Input sensor and display device having the same

ABSTRACT

An input sensor includes a plurality of first sensing electrodes, a plurality of second sensing electrodes, a plurality of first sensing lines, a plurality of second sensing lines, a first connection line, and a second connection line. The plurality of first sensing lines are electrically connected to the plurality of first sensing electrodes, respectively. The plurality of second sensing lines are electrically connected to the plurality of second sensing electrodes, respectively. The first connection line electrically connects a pair of first sensing electrodes of the plurality of first sensing electrodes. The second connection line electrically connects a pair of second sensing electrodes of the plurality of second sensing electrodes.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority to and the benefit of Korean PatentApplication No. 10-2019-0110525, filed Sep. 6, 2019, which is herebyincorporated by reference for all purposes as if fully set forth herein.

BACKGROUND Field

Some exemplary embodiments generally relate to a display device, andmore particularly, to a display device including an input sensor.

Discussion

Multimedia display devices, such as televisions, mobile phones, tabletcomputers, navigators, game consoles, and the like, are provided todisplay an image. Such a display device may include an input sensor,which is capable of providing a touch-based input manner that allows auser to easily input information or commands intuitively andconveniently in addition to usual input manners, such as inputs via abutton, a keyboard, a mouse, and the like.

The input sensor may sense a touch or pressure using a user's body.There is an increasing demand for using an electronic pen for fine touchinput for a user who is familiar with information input using a writinginstrument or an application program (for example, an applicationprogram for sketching or drawing). Accordingly, there is interest in aninput sensor capable of sensing not only an electronic pen input, butalso at least one of an input by a touch or pressure interaction via auser's body.

The above information disclosed in this section is only forunderstanding the background of the inventive concepts, and, therefore,may contain information that does not form prior.

SUMMARY

Some aspects provide an input sensor capable of sensing a touch (ortouch interaction) by a user's body and a touch by an electronic pen.

Some aspects provide a display device including an input sensor capableof sensing a touch (or touch interaction) by a user's body and a touchby an electronic pen.

Additional aspects will be set forth in the detailed description whichfollows, and, in part, will be apparent from the disclosure, or may belearned by practice of the inventive concepts.

According to some aspects, an input sensor includes a plurality of firstsensing electrodes, a plurality of second sensing electrodes, aplurality of first sensing lines, a plurality of second sensing lines, afirst connection line, and a second connection line. The plurality offirst sensing lines are electrically connected to the plurality of firstsensing electrodes, respectively. The plurality of second sensing linesare electrically connected to the plurality of second sensingelectrodes, respectively. The first connection line electricallyconnects a pair of first sensing electrodes of the plurality of firstsensing electrodes. The second connection line electrically connects apair of second sensing electrodes of the plurality of second sensingelectrodes.

According to some aspects, an input sensor includes a plurality of firstsensing electrodes, a plurality of second sensing electrodes, aplurality of first sensing lines, a plurality of second sensing lines, aplurality of third sensing lines, and a plurality of fourth sensinglines. Each of the plurality of first sensing electrodes includes aplurality of first sub-sensor parts, a plurality of second sub-sensorparts, and a plurality of first sub-connection parts. The plurality ofsecond sensing electrodes are insulated from the plurality of firstsensing electrodes. Each of the plurality of second sensing electrodesincludes a plurality of third sub-sensor parts, a plurality of fourthsub-sensor parts, and a plurality of second sub-connection parts. Theplurality of first sensing lines are electrically connected to firstends of the plurality of first sensing electrodes, respectively. Theplurality of second sensing lines are electrically connected to firstends of the plurality of second sensing electrodes, respectively. Theplurality of third sensing lines are disposed between the plurality ofthird sub-sensor parts and the plurality of fourth sub-sensor parts.Each of the plurality of third sensing lines have one end electricallyconnected to a second end of a corresponding one of the plurality offirst sensing electrodes. The plurality of fourth sensing lines aredisposed between the plurality of first sub-sensor parts and theplurality of second sub-sensor parts. Each of the plurality of fourthsensing lines have one end electrically connected to a second end of acorresponding one of the plurality of second sensing electrodes. Theplurality of first sub-connection parts electrically connect theplurality of first sub-sensor parts to the plurality of secondsub-sensor parts. The plurality of second sub-connection partselectrically connect the plurality of third sub-sensor parts to theplurality of fourth sub-sensor parts.

According to some aspects, an input sensor includes a plurality of firstsensing electrodes; a plurality of second sensing electrodes; aplurality of first sensing lines; a plurality of second sensing lines; aplurality of third sensing lines; and a plurality of fourth sensinglines. Each of the plurality of first sensing electrodes includes aplurality of first sub-sensor parts, a plurality of second sub-sensorparts, and a plurality of first sub-connection parts. The plurality ofsecond sensing electrodes are insulated from the plurality of firstsensing electrodes. Each of the plurality of second sensing electrodesincludes a plurality of third sub-sensor parts, a plurality of fourthsub-sensor parts, and a plurality of second sub-connection parts. Theplurality of first sensing lines are electrically connected to firstends of the plurality of first sensing electrodes, respectively. Theplurality of second sensing lines are electrically connected to firstends of the plurality of second sensing electrodes, respectively. Theplurality of third sensing lines are disposed between the plurality offirst sub-sensor parts and the plurality of second sub-sensor parts. Theplurality of fourth sensing lines are disposed between the plurality ofthird sub-sensor parts and the plurality of fourth sub-sensor parts. Apair of corresponding third sensing lines of the plurality of thirdsensing lines are electrically connected to each other. A pair ofcorresponding fourth sensing lines of the plurality of fourth sensinglines are electrically connected to each other. The plurality of firstsub-connection parts and the plurality of second sub-connection partsare formed from a first conductive layer. The plurality of first tofourth sub-sensor parts and the plurality of first to fourth sensinglines are formed from a second conductive layer. An insulation layer isdisposed between the first conductive layer and the second conductivelayer.

According to some aspects, a display device includes a display panelconfigured to display an image, an input sensor disposed on a firstsurface of the display panel, and a sensing circuit configured toreceive first input information and second input information from theinput sensor. The input sensor includes a plurality of first sensingelectrodes, a plurality of first sensing lines, a plurality of secondsensing electrodes, a plurality of second sensing lines, a firstconnection line, and a second connection line. The plurality of firstsensing lines are electrically connected to the plurality of firstsensing electrodes, respectively. The plurality of second sensing linesare electrically connected to the plurality of second sensingelectrodes, respectively. The first connection line electricallyconnects a pair of first sensing electrodes of the plurality of firstsensing electrodes. The second connection line electrically connects apair of second sensing electrodes of the plurality of second sensingelectrodes. The sensing circuit is further configured to receive thefirst input information through the plurality of first sensing lines andthe plurality of second sensing lines in a first sensing mode, and toreceive the second input information through the plurality of firstsensing lines and the plurality of second sensing lines in a secondsensing mode.

The foregoing general description and the following detailed descriptionare exemplary and explanatory and are intended to provide furtherexplanation of the claimed subject matter.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the inventive concepts, and are incorporated in andconstitute a part of this specification, illustrate exemplaryembodiments of the inventive concepts, and, together with thedescription, serve to explain principles of the inventive concepts. Inthe drawings:

FIG. 1 is a perspective view of a display device according to someexemplary embodiments;

FIG. 2 is a cross-sectional view of the display device of FIG. 1according to some exemplary embodiments;

FIG. 3 is a cross-sectional view of a display panel according to someexemplary embodiments;

FIG. 4 is a plan view of the display panel of FIG. 3 according to someexemplary embodiments;

FIG. 5A is an enlarged cross-sectional view of the display panel of FIG.3 according to some exemplary embodiments;

FIG. 5B is an enlarged cross-sectional view of an upper insulation layeraccording to some exemplary embodiments;

FIG. 6 is a cross-sectional view of an input sensor according to someexemplary embodiments;

FIG. 7A is a plan view of the input sensor of FIG. 6 according to someexemplary embodiments;

FIG. 7B is an enlarged view of a first area of the input sensor of FIG.7A according to some exemplary embodiments;

FIGS. 7C and 7D are partial cross-sectional views of the input sensor ofFIG. 6 according to various exemplary embodiments;

FIG. 7E is a schematic view illustrating first sensing electrodes andsecond sensing electrodes of the input sensor of FIG. 7A according tosome exemplary embodiments;

FIG. 8A is a plan view of an input sensor according to some exemplaryembodiments;

FIG. 8B is an enlarged view illustrating a second area of the inputsensor of FIG. 8A according to some exemplary embodiments;

FIGS. 8C, 8D, and 8E are partial cross-sectional views of the inputsensor of FIG. 8A according to some exemplary embodiments;

FIG. 9A is a plan view of an input sensor according to some exemplaryembodiments;

FIG. 9B is an enlarged view illustrating a third area of the inputsensor of FIG. 9A according to some exemplary embodiments;

FIGS. 9C, 9D, and 9E are partial cross-sectional views of the inputsensor of FIG. 9A according to some exemplary embodiments;

FIG. 10 is a plan view of an input sensor according to some exemplaryembodiments;

FIG. 11 is a plan view of an input sensor according to some exemplaryembodiments;

FIG. 12A is a plan view of an input sensor according to some exemplaryembodiments;

FIG. 12B is an enlarged view illustrating a fourth area of the inputsensor of FIG. 12A according to some exemplary embodiments; and

FIG. 12C is a partial cross-sectional view of the input sensor of FIG.12B according to some exemplary embodiments.

DETAILED DESCRIPTION OF SOME EXEMPLARY EMBODIMENTS

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various exemplary embodiments. As used herein, theterms “embodiments” and “implementations” are used interchangeably andare non-limiting examples employing one or more of the inventiveconcepts disclosed herein. It is apparent, however, that variousexemplary embodiments may be practiced without these specific details orwith one or more equivalent arrangements. In other instances, well-knownstructures and devices are shown in block diagram form in order to avoidunnecessarily obscuring various exemplary embodiments. Further, variousexemplary embodiments may be different, but do not have to be exclusive.For example, specific shapes, configurations, and characteristics of anexemplary embodiment may be used or implemented in another exemplaryembodiment without departing from the inventive concepts.

Unless otherwise specified, the illustrated exemplary embodiments are tobe understood as providing exemplary features of varying detail of someexemplary embodiments. Therefore, unless otherwise specified, thefeatures, components, modules, layers, films, panels, regions, aspects,etc. (hereinafter individually or collectively referred to as an“element” or “elements”), of the various illustrations may be otherwisecombined, separated, interchanged, and/or rearranged without departingfrom the inventive concepts.

The use of cross-hatching and/or shading in the accompanying drawings isgenerally provided to clarify boundaries between adjacent elements. Assuch, neither the presence nor the absence of cross-hatching or shadingconveys or indicates any preference or requirement for particularmaterials, material properties, dimensions, proportions, commonalitiesbetween illustrated elements, and/or any other characteristic,attribute, property, etc., of the elements, unless specified. Further,in the accompanying drawings, the size and relative sizes of elementsmay be exaggerated for clarity and/or descriptive purposes. As such, thesizes and relative sizes of the respective elements are not necessarilylimited to the sizes and relative sizes shown in the drawings. When anexemplary embodiment may be implemented differently, a specific processorder may be performed differently from the described order. Forexample, two consecutively described processes may be performedsubstantially at the same time or performed in an order opposite to thedescribed order. Also, like reference numerals denote like elements.

When an element, such as a layer, is referred to as being “on,”“connected to,” or “coupled to” another element, it may be directly on,connected to, or coupled to the other element or intervening elementsmay be present. When, however, an element is referred to as being“directly on,” “directly connected to,” or “directly coupled to” anotherelement, there are no intervening elements present. Other terms and/orphrases used to describe a relationship between elements should beinterpreted in a like fashion, e.g., “between” versus “directlybetween,” “adjacent” versus “directly adjacent,” “on” versus “directlyon,” etc. Further, the term “connected” may refer to physical,electrical, and/or fluid connection. In addition, the DR1-axis, theDR2-axis, and the DR3-axis are not limited to three axes of arectangular coordinate system, and may be interpreted in a broadersense. For example, the DR1-axis, the DR2-axis, and the DR3-axis may beperpendicular to one another, or may represent different directions thatare not perpendicular to one another. For the purposes of thisdisclosure, “at least one of X, Y, and Z” and “at least one selectedfrom the group consisting of X, Y, and Z” may be construed as X only, Yonly, Z only, or any combination of two or more of X, Y, and Z, such as,for instance, XYZ, XYY, YZ, and ZZ. As used herein, the term “and/or”includes any and all combinations of one or more of the associatedlisted items.

Although the terms “first,” “second,” etc. may be used herein todescribe various elements, these elements should not be limited by theseterms. These terms are used to distinguish one element from anotherelement. Thus, a first element discussed below could be termed a secondelement without departing from the teachings of the disclosure.

Spatially relative terms, such as “beneath,” “below,” “under,” “lower,”“above,” “upper,” “over,” “higher,” “side” (e.g., as in “sidewall”), andthe like, may be used herein for descriptive purposes, and, thereby, todescribe one element's relationship to another element(s) as illustratedin the drawings. Spatially relative terms are intended to encompassdifferent orientations of an apparatus in use, operation, and/ormanufacture in addition to the orientation depicted in the drawings. Forexample, if the apparatus in the drawings is turned over, elementsdescribed as “below” or “beneath” other elements or features would thenbe oriented “above” the other elements or features. Thus, the exemplaryterm “below” can encompass both an orientation of above and below.Furthermore, the apparatus may be otherwise oriented (e.g., rotated 90degrees or at other orientations), and, as such, the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof. It is also noted that, as used herein, the terms“substantially,” “about,” and other similar terms, are used as terms ofapproximation and not as terms of degree, and, as such, are utilized toaccount for inherent deviations in measured, calculated, and/or providedvalues that would be recognized by one of ordinary skill in the art.

Various exemplary embodiments are described herein with reference tosectional views, isometric views, perspective views, plan views, and/orexploded illustrations that are schematic illustrations of idealizedexemplary embodiments and/or intermediate structures. As such,variations from the shapes of the illustrations as a result of, forexample, manufacturing techniques and/or tolerances, are to be expected.Thus, exemplary embodiments disclosed herein should not be construed aslimited to the particular illustrated shapes of regions, but are toinclude deviations in shapes that result from, for instance,manufacturing. To this end, regions illustrated in the drawings may beschematic in nature and shapes of these regions may not reflect theactual shapes of regions of a device, and, as such, are not intended tobe limiting.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and will not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

As customary in the field, some exemplary embodiments are described andillustrated in the accompanying drawings in terms of functional blocks,units, and/or modules. Those skilled in the art will appreciate thatthese blocks, units, and/or modules are physically implemented byelectronic (or optical) circuits, such as logic circuits, discretecomponents, microprocessors, hard-wired circuits, memory elements,wiring connections, and the like, which may be formed usingsemiconductor-based fabrication techniques or other manufacturingtechnologies. In the case of the blocks, units, and/or modules beingimplemented by microprocessors or other similar hardware, they may beprogrammed and controlled using software (e.g., microcode) to performvarious functions discussed herein and may optionally be driven byfirmware and/or software. It is also contemplated that each block, unit,and/or module may be implemented by dedicated hardware, or as acombination of dedicated hardware to perform some functions and aprocessor (e.g., one or more programmed microprocessors and associatedcircuitry) to perform other functions. Also, each block, unit, and/ormodule of some exemplary embodiments may be physically separated intotwo or more interacting and discrete blocks, units, and/or moduleswithout departing from the inventive concepts. Further, the blocks,units, and/or modules of some exemplary embodiments may be physicallycombined into more complex blocks, units, and/or modules withoutdeparting from the inventive concepts.

Hereinafter, various exemplary embodiments will be explained in detailwith reference to the accompanying drawings.

FIG. 1 is a perspective view of a display device DD according to someexemplary embodiments. FIG. 2 is a cross-sectional view of the displaydevice DD according to some exemplary embodiments.

Referring to FIG. 1, the display device DD may display an image IMthrough a display surface DD-IS. The display surface DD-IS is parallelto a surface defined by a first directional axis DR1 and a seconddirectional axis DR2. A normal direction of the display surface DD-IS,e.g., a thickness direction of the display device DD is indicated as athird directional axis DR3.

A front surface (or a top surface) and a rear surface (or a bottomsurface) of each of layers, members, units, or other elements, whichwill be described below, are distinguished by the third directional axisDR3. However, the first to third directional axes DR1 to DR3 illustratedin, for example, FIG. 1 may be merely examples. Hereinafter, first tothird directions may be directions indicated by the first to thirddirectional axes DR1, DR2, and DR3 and designated by the same referencenumerals, respectively.

Although the display device DD having a planar display surface isillustrated as an embodiment, embodiments are not limited thereto. Thedisplay device DD may additionally or alternatively include a curveddisplay surface. The display device DD may include a solid displaysurface. The solid display surface may include a plurality of displayareas that indicate different directions. For example, the solid displaysurface may include a polygonal column-type display surface.

The display device DD according to some embodiments may be a rigiddisplay device. However, embodiments are not limited thereto. Forexample, the display DD may be a flexible display device or a hybriddisplay device including at least one rigid portion and at least oneflexible portion. The flexible display device may include afoldable-type display device or a bending-type display device of which aportion is bent.

For convenience, the display device DD is capable of being applied to amobile terminal is exemplarily illustrated and described in associationwith FIG. 1. According to various embodiments, electronic modules, acamera module, a power module, and/or the like, which may be mounted ona main board, may be disposed on a bracket/case together with thedisplay device DD to constitute the mobile terminal. The display deviceDD according to some exemplary embodiments may be applied to large-sizedelectronic apparatuses, such as televisions, monitors, etc., and smalland/or mid-sized electronic apparatuses, such as tablet personalcomputers, navigation units for vehicles, game consoles, smart watches,etc.

As illustrated in FIG. 1, the display surface DD-IS includes an imagearea DD-DA on (or in) which an image IM is displayed, and a bezel areaDD-NDA adjacent to the image area DD-DA. The bezel area DD-NDA may be anarea on which an image is not displayed. FIG. 1 at least illustrates anicon as an example of the image IM.

As illustrated in FIG. 1, the image area DD-DA may have a substantiallyrectangular shape. The “substantially rectangular shape” includes notonly a rectangular shape in a mathematical sense, but also a rectangularshape in which a vertex is not defined in a vertex area (or a cornerarea), but a boundary of a curve is defined. It, however, iscontemplated that any other suitable shape may be utilized.

The bezel area DD-NDA may surround the image area DD-DA. However,embodiments are not limited thereto. For example, the image area DD-DAand the bezel area DD-NDA may be designed in different shapes. The bezelarea DD-NDA may be disposed on only one side of the image area DD-DA.The bezel area DD-NDA may not be exposed to the outside according tocoupled configurations of the display device DD and other components ofan electronic device including the display device DD.

The display device DD according to some exemplary embodiments may sensea first input TC of a user that is applied from the outside. The firstinput TC1 of the user may be one or a combination of various types ofexternal inputs, such as at least one of a portion of the user's body,light, heat, and a pressure. For convenience, it will be assumed thatthe first input TC1 of the user is a touch input by a user's handapplied to the front surface, but this is merely illustrative, and thus,as described above, the first input TC1 may be provided in various formsto one or more surfaces of the display device DD. For instance, thedisplay device DD may sense the first input TC1 of the user that isapplied to a side or rear surface of the display device DD, according toa structure of the display device DD, but is not limited to a specificembodiment.

Also, the display device DD according to some exemplary embodiments maysense a second input TC2 applied from the outside. The second input TC2includes inputs by, for instance, an electronic input device (e.g.,stylus pen, touch pen, electronic pen, e-pen, etc.) in addition to theuser's hand. In the following description, it will be assumed that thesecond input TC2 is an input by an electronic pen EP. The electronic penEP includes a tip TP (or other portion) made of a conductive material.The display device DD senses an electromagnetic resonance (EMR) due toelectromagnetic induction generated between internally generatedmagnetic fields and the tip TP of the electronic pen EP to sense thesecond input TC2.

FIG. 2 illustrates a cross-section defined by the first directional axisDR1 and the third directional axis DR3. In FIG. 2, the components of thedisplay device DD are simply (or generally) illustrated to explain theirlamination relationship.

The display device DD according to some exemplary embodiments mayinclude a display panel DP, an input sensor ISL, an anti-reflector RPP,and a window WP. The components of at least some of the display panelDP, the input sensor ISL, the anti-reflector RPP, and the window WP maybe formed through a continuous process without an adhesive member, orthe components of at least some may be coupled to each other through anadhesive member, such as adhesive member ADS. The adhesive member ADSmay be a transparent adhesive member, such as a pressure sensitiveadhesive film (PSA), an optically clear adhesive film (OCA), and/or anoptically clear resin (OCR). The adhesive member ADS described below mayinclude a conventional adhesive or an adhesive agent. In one embodiment,the anti-reflector RPP and the window WP may be replaced by othercomponents or omitted.

In FIG. 2, the input sensor ISL formed together with the display panelDP among the input sensor ISL, the anti-reflector RPP, and the window WPthrough the continuous process is directly disposed on the display panelDP. For the purposes of this disclosure, that “a component B is disposeddirectly on a component A” means that no separate adhesivelayer/adhesive member is disposed between the component A and thecomponent B. As such, the component B is formed through a continuousprocess on a base surface provided by the component A, such as after thecomponent A is formed.

In an embodiment, each of the anti-reflector RPP and the window WP isprovided as a “panel” type, and the input sensor ISL is provided as a“layer” type. The “panel” type includes a base layer that provides abase surface, for example, a synthetic resin film, a composite film, aglass substrate, and/or the like, but the base layer may be omitted inthe “layer” type. That is to say, the components of the “layer” type aredisposed on the base surface provided by another component. The “layer”type may also be referred to as a “film” type. In an embodiment, theanti-reflector RPP and the window WP may be provided as the “layer”type.

The display panel DP generates an image, and the input sensor ISLobtains coordinate information of an external input (e.g., a touchevent). The display device DD according to some exemplary embodimentsmay further include a protection member disposed on a bottom surface ofthe display panel DP. The protection member and the display panel DP maybe coupled to each other through an adhesive member.

The display panel DP according to some exemplary embodiments may be anemission type display panel, but is not limited thereto. For example,the display panel DP may be an organic light emitting display panel, aquantum dot light emitting display panel, an inorganic light emittingdisplay panel, etc. The panels are classified according to a material ofthe light emitting device. A light emitting layer of the organic lightemitting display panel may include an organic light emitting material. Alight emitting layer of the quantum dot light emitting display panel mayinclude a quantum dot and/or a quantum rod. A light emitting layer ofthe inorganic light emitting display panel may include an inorganiclight emitting material. Hereinafter, the display panel DP will bedescribed as an organic light emitting display panel.

The anti-reflector RPP reduces reflectance of external light incidentfrom an upper side of the window WP. The anti-reflector RPP according tosome exemplary embodiments may include a phase retarder and a polarizer.The phase retarder may be a film type or a liquid crystal coating type,and may include a π/2 phase retarder and/or a π/4 phase retarder. Thepolarizer may also be a film type or liquid crystal coating typepolarizer. The film type may include an elongation-type synthetic resin,and the liquid crystal coating type may include liquid crystals that arearranged in a predetermined arrangement. Each of the phase retarder andthe polarizer may further include a protection film. The phase retarderand polarizer itself or the protection film may be defined as the baselayer of the anti-reflector RPP.

The anti-reflector RPP according to some exemplary embodiments mayinclude color filters. The color filters may have a predeterminedarrangement. The arrangement of the color filters may be determined inconsideration of emission colors of the pixels provided in the displaypanel DP. The anti-reflector RPP may further include a black matrixadjacent to the color filters.

The anti-reflector RPP according to some exemplary embodiments mayinclude a destructive interference structure. For example, thedestructive interference structure may include a first reflection layerand a second reflection layer that are disposed on layers different fromeach other. First reflected light and second reflected light, which arerespectively reflected by the first reflection layer and the secondreflection layer, may destructively interfere with each other to reducethe reflectance of the external light.

The window WP according to some exemplary embodiments includes a baselayer WP-BS and a light blocking pattern WP-BZ. The base layer WP-BS mayinclude a glass substrate and/or a synthetic resin film. The base layerWP-BS is not limited to a single layer. The base layer WP-BS may includetwo or more films bonded by the adhesive member.

The light blocking pattern WP-BZ partially overlaps the base layerWP-BS. The light blocking pattern WP-BZ may be disposed on a rearsurface of the base layer WP-BS, and the light blocking pattern WP-BZmay substantially define the bezel area DD-NDA of the display device DD.An area on which the light blocking pattern WP-BZ is not disposed maydefine the image area DD-DA of the display device DD. When limited tothe window WP, an area on which the light blocking pattern WP-BZ isdisposed is defined as a light blocking area of the window WP, and anarea on which the light blocking pattern WP-BZ is not disposed isdefined as a transmission area of the window WP.

The light blocking pattern WP-BZ may have a multi-layered structure. Themulti-layered structure may include a chromatic color layer and anachromatic (e.g., black color) light blocking layer. The chromatic colorlayer and the achromatic black light blocking layer may be formedthrough at least one of deposition, printing, and coating processes. Thewindow WP may further include a functional coating layer disposed on anentire surface of the base layer WP-BS. The functional coating layer mayinclude at least one of an anti-fingerprint layer, an anti-reflectionlayer, a hard coating layer, and the like.

FIG. 3 is a cross-sectional view of the display panel DP according tosome exemplary embodiments. FIG. 4 is a plan view of the display panelDP according to some exemplary embodiments.

As illustrated in FIG. 3, the display panel DP may include a base layerBL, a circuit element layer DP-CL disposed on the base layer BL, adisplay element layer DP-OLED, and an upper insulation layer TFL. Adisplay area DP-DA and a non-display area DP-NDA, which correspond tothe image area DD-DA and the bezel area DD-NDA of FIG. 1, may bedefined. For the purposes of this disclosure, that a “region/portionand/or area/portion corresponds to each other” means “overlap eachother,” but is not limited to having the same area and/or the sameshape.

The base layer BL may include at least one synthetic resin film. Thebase layer BL may include a at least one of a glass substrate, a metalsubstrate, and an organic/inorganic composite substrate.

The circuit element layer DP-CL includes at least one insulation layerand at least one circuit element. The insulation layer includes at leastone inorganic layer and at least one organic layer. The circuit elementincludes signal lines, a pixel driving circuit, and the like.

The display element layer DP-OLED may include at least one organic lightemitting diode as a light emitting element. The display element layerDP-OLED may further include an organic layer, such as a pixel defininglayer.

The upper insulation layer TFL may include a plurality of thin films.One portion of the thin films may be disposed to improve opticalefficiency, and the one portion of the thin film may be disposed toprotect the organic light emitting diodes. The upper insulation layerTFL will be described later in more detail.

As illustrated in FIG. 4, the display panel DP includes a drivingcircuit GDC, a plurality of signal lines SGL (hereinafter, referred toas signal lines), a plurality of signal pads DP-PD, ISL-PD (hereinafter,referred to as signal pads), and a plurality of pixels PX (hereinafter,referred to as pixels).

The driving circuit GDC may include a scan driving circuit. The scandriving circuit generates a plurality of scan signals (hereinafter,referred to as scan signals) to sequentially output the scan signals toa plurality of scan lines GL (hereinafter, referred to as scan lines)that will be described later. The scan driving circuit may furtheroutput another control signal to the driving circuit of the pixels PX.

The scan driving circuit may include a plurality of transistors that aremanufactured through the same process(es) as the driving circuit of thepixel PX, e.g., at least one of a low temperature polycrystallinesilicon (LTPS) process and a low temperature polycrystalline oxide(LTPO) process.

The signal lines SGL include scan lines GL, data lines DL, a power linePL, and a control signal line CSL. The scan lines GL are respectivelyconnected to corresponding pixels PX of the pixels PX, and the datalines DL are respectively connected to corresponding pixels PX of thepixels PX. The power line PL is connected to the pixels PX. The controlsignal line CSL may provide control signals to the scan driving circuit.

In an embodiment, the signal lines SGL may further include auxiliarylines SSL. The auxiliary lines SSL are signal lines connected to theinput sensor ISL (see FIG. 2). In an embodiment, the auxiliary lines SSLmay be omitted.

The signal lines SGL may include a plurality of portions disposed ondifferent layers. FIG. 4 illustrates an example of the auxiliary linesSSL that includes the data lines DL including four portions P1 to P4 andthe auxiliary lines SSL including two portions P10 to P20. The fourportions P1 to P4 may be connected through contact holes CNT, and thetwo portions P10 and P20 may be connected through the contact holes CNT.The first portion P10 of the auxiliary lines SSL is connected to thesignal line(s) of the input sensor layer ISL (see FIG. 6B), which willbe described below, through the contact holes CNT.

The signal pads DP-PD and ISL-PD may include first type signal padsDP-PD connected to the data lines DL, the power line PL, and the controlsignal line CSL, and include second type signal pads ISL-PD connected tothe auxiliary lines SSL. The first type signal pads DP-PD and the secondtype signal pads ISL-PD are disposed adjacent to each other on a padarea NDA-PA defined on a portion of the non-display area DP-NDA. The padarea NDA-PA may be adjacent to an edge DP-E of the display panel DP. Thesignal pads DP-PD and ISL-PD may be formed through the same process(es)without distinguishing lamination structures or constituent materialsfrom each other.

The display area DP-DA may be defined as an area on which the pixels PXare disposed. A plurality of electronic elements may be disposed on thedisplay area DP-DA. The electronic elements include an organic lightemitting diode OLED provided in each of the pixels PX and a pixeldriving circuit connected to the organic light emitting diode OLED. Thedriving circuit GDC, the signal lines SGL, the signal pads DP-PD andISL-PD, and the pixel driving circuit may be provided in the circuitelement layer DP-CL illustrated in FIG. 3.

For example, the pixel PX may include a first transistor T1, a secondtransistor T2, a capacitor CP, and an organic light emitting diode OLED.The pixel driving circuit is sufficient to include a switchingtransistor and a driving transistor, but is not limited to theembodiment shown in FIG. 4. The first transistor T1 is connected to thescan line SL and the data line DL. The organic light emitting diode OLEDreceives a power voltage provided from the power line PL.

In FIG. 4, a circuit board PCB electrically connected to the displaypanel DP is additionally illustrated. The circuit board PCB may be arigid circuit board or a flexible circuit board.

A panel control circuit PC that controls an operation of the displaypanel DP may be disposed on the circuit board PCB. Also, an inputsensing circuit ISL-C that controls the input sensor ISL may be disposedon the circuit board PCB. Each of the panel control circuit PC and theinput sensing circuit ISL-C may be mounted on the circuit board PCB inthe form of integrated chips, but embodiments are not limited thereto.In another embodiment, the panel control circuit PC and the inputsensing circuit ISL-C may be mounted on the circuit board PCB in theform of one integrated chip. The input sensing circuit ISL-C may includea first sensing circuit TC-C for sensing the first input TC1 of theuser, which is illustrated in FIG. 1, and a second sensing circuit EP-Cfor sensing the second input TC2 by the electronic pen EP. The firstsensing circuit TC-C and the second sensing circuit EP-C may be mountedon the circuit board PCB in the form of one integrated chip like theinput sensing circuit ISL-C. In another embodiment, each of the firstsensing circuit TC-C and the second sensing circuit EP-C may be mountedon the circuit board PCB in the form of a separate integrated chip. Thecircuit board PCB may include circuit board pads PCB-P electricallyconnected to the signal pads DP-PD and ISL-PD. The circuit board PCB mayfurther include signal lines connecting the circuit board pads PCB-P tothe panel control circuit PC and/or the input sensing circuit ISL-C.Also, the circuit board pads PCB-P may include at least one output padand at least one input pad.

The signal pads DP-PD and ISL-PD of the display panel DP and the circuitboard pads PCB-P may be directly connected to each other. In anotherembodiment, the signal pads DP-PD and ISL-PD and the circuit board padsPCB-P may be electrically connected to each other through a connectingsubstrate, such as an anisotropic conductive film.

In another embodiment, the panel control circuit PC may be mounted onthe non-display area DP-NDA of the display panel DP instead of thecircuit board PCB.

A portion of the display panel DP illustrated in FIG. 4 may be bent. Aportion of the non-display area DP-NDA may be bent with respect to abending axis parallel to a second direction DR2, but exemplaryembodiments are not limited thereto. In some embodiments, the bendingaxis may be defined to overlap the third portions P3 of the data linesDL and the first portion P10 of the auxiliary lines SSL.

FIG. 5A is an enlarged cross-sectional view of the display panel DPaccording to some exemplary embodiments. FIG. 5B is an enlargedcross-sectional view of an upper insulation layer TFL according to someexemplary embodiments.

Referring to FIG. 5A, the display panel DP may include a plurality ofinsulation layers, a semiconductor pattern, a conductive pattern, asignal line, and the like. The insulation layer, the semiconductorlayer, and the conductive layer may be formed through methods, such ascoating, deposition, and the like. Thereafter, the insulation layer, thesemiconductor layer, and the conductive layer may be selectivelypatterned in a photolithography manner. The semiconductor pattern, theconductive pattern, and the signal line that are provided in the circuitelement layer DP-CL and the display element layer DP-OLED may be formedin the above-described manner.

The base layer BL may include a synthetic resin film. The syntheticresin layer may include a thermosetting resin. The base layer BL mayhave a multi-layered structure. For example, the base layer BL may havea three-layer structure of a synthetic resin layer, an adhesive layer,and a synthetic resin layer. For example, the synthetic resin layer maybe a polyimide resin layer, and the material thereof is not particularlylimited. For instance, the synthetic resin layer may include at leastone of an acrylic-based resin, a methacrylic-based resin, apolyisoprene-based resin, a vinyl-based resin, an epoxy-based resin, aurethane-based resin, a cellulose-based resin, a siloxane-based resin, apolyamide-based resin, and a perylene-based resin. In addition, thesynthetic resin layer may include at least one of a glass substrate, ametal substrate, and an organic/inorganic composite substrate.

At least one inorganic layer may be disposed on a top surface of thebase layer BL. The inorganic layer may include at least one of oxide,titanium oxide, silicon oxide, silicon oxide nitride, zirconium oxide,and hafnium oxide. The inorganic layer may be provided as a multilayerstructure. The multi-layered inorganic layer may constitute a barrierlayer and/or a buffer layer. As seen in FIG. 5A, the display panel DP isshown as including a buffer layer BFL.

The buffer layer BFL may improve bonding force between the base layer BLand the semiconductor pattern. The buffer layer BFL may include at leastone of a silicon oxide layer and a silicon nitride layer. In someimplementations, the silicon oxide layer and the silicon nitride layermay be alternately laminated.

The semiconductor pattern is disposed on the buffer layer BFL. Thesemiconductor pattern may include polysilicon. However, embodiments arenot limited thereto. For example, the semiconductor pattern may includeamorphous silicon or metal oxide.

FIG. 5A illustrates merely a portion of the semiconductor pattern. Forexample, the semiconductor pattern may be further disposed on otherareas of the pixel PX on the plane. The semiconductor pattern may bearranged in a determined pattern in the pixels PX. The semiconductorpattern has different electrical properties depending on whether thesemiconductor pattern is doped. The semiconductor pattern may include adoped region and a non-doped region. The doped region may be doped withan N-type dopant or a P-type dopant. A P-type transistor includes adoped region into which the P-type dopant is doped, and an N-typetransistor includes a doped region into which the N-type dopant isdoped.

The doped region may have conductivity greater than that of thenon-doped region and substantially act as an electrode or a signal line.The non-doped region may substantially correspond to an active portion(or a channel) of the transistor. That is to say, a portion of thesemiconductor pattern may be an active portion of the transistor,another portion may be a source or drain of the transistor, and yetanother portion may be a connection electrode or a connection signalline.

As illustrated in FIG. 5A, a source portion S1, an active portion A1,and a drain portion D1 of a first transistor T1 may be formed from thesemiconductor pattern, and a source portion S2, an active portion A2,and a drain portion D2 of the second transistor T2 may be formed fromthe semiconductor pattern. The source portions S1 and S2 and the drainportions D1 and D2 extend from the active portions A1 and A2 indirections opposite to each other. FIG. 5A illustrates a portion of theconnection signal line SCL formed from the semiconductor pattern. Theconnection signal line SCL may be connected to the drain portion D2 ofthe second transistor T2 on the plane.

A first insulation layer 10 is disposed on the buffer layer BFL. Thefirst insulation layer 10 commonly overlaps the plurality of pixels PX(see FIGS. 4 and 5A) and covers the semiconductor pattern. The firstinsulation layer 10 may include an inorganic layer and/or an organiclayer, and may have a single-layered or multi-layered structure. Thefirst insulation layer 10 may include at least one of oxide, titaniumoxide, silicon oxide, silicon oxide nitride, zirconium oxide, andhafnium oxide. In one embodiment, the first insulation layer 10 mayinclude a single-layered silicon oxide layer. The insulation layer ofthe circuit element layer DP-CL, which will be described later, as wellas the first insulation layer 10 may be an inorganic layer and/or anorganic layer, and may have a single-layered or a multi-layeredstructure. The inorganic layer may include at least one of theabove-described materials.

Gates G1 and G2 are disposed on the first insulation layer 10. Each ofthe gates G1 and G2 may be a portion of the metal pattern. The gates G1and G2 overlap the active portions A1 and A2. In a process of doping thesemiconductor pattern, the gates G1 and G2 may serve as masks.

A second insulation layer 20 covering the gates G1 and G2 is disposed onthe first insulation layer 10. The second insulation layer 20 commonlyoverlaps the pixels PX (see FIGS. 4 and 5A). The second insulation layer20 may include an inorganic layer and/or an organic layer, and may havea single-layered or multi-layered structure. In an embodiment, thesecond insulation layer 20 may include a single-layered silicon oxidelayer.

An upper electrode UE may be disposed on the second insulation layer 20.The upper electrode UE may overlap the gate G2 of the second transistorT2. The upper electrode UE may be a portion of the metal pattern. Aportion of the gate G2 and the upper electrode UE overlapping theportion of the gate G2 may define a capacitor CP (see FIG. 4). In anembodiment, the upper electrode UE may be omitted.

A third insulation layer 30 covering the upper electrode UE is disposedon the second insulation layer 20. In an embodiment, the thirdinsulation layer 30 may include a single-layered silicon oxide layer.The first connection electrode CNE1 may be disposed on the thirdinsulation layer 30. The first connection electrode CNE1 may beconnected to the signal line SCL through a contact hole CNT-1 passingthrough the first to third insulation layers 10 to 30.

A fourth insulation layer 40 covering the first connection electrodeCNE1 may be disposed on the third insulation layer 30. The fourthinsulation layer 40 may be a single-layered silicon oxide layer. Thefourth insulation layer 40 is disposed on a fifth insulation layer 50.The fifth insulation layer 50 may be an organic layer. A secondconnection electrode CNE2 may be disposed on the fifth insulation layer50. The second connection electrode CNE2 may be connected to the firstconnection electrode CNE1 through a contact hole CNT-2 passing throughthe fourth insulation layer 40 and the fifth insulation layer 50.

A sixth insulation layer 60 covering the second connection electrodeCNE2 is disposed on the fifth insulation layer 50. The sixth insulationlayer 60 may be an inorganic layer. A first electrode AE is disposed onthe sixth insulation layer 60. The first electrode AE is connected tothe second connection electrode CNE2 through a contact hole CNT-3passing through the sixth insulation layer 60. An opening OP is definedin the pixel defining layer PDL. The opening OP of the pixel defininglayer PDL exposes at least a portion of the first electrode AE.

As illustrated in FIG. 5A, the display area DP-PA may include anemission area PXA and a non-emission area NPXA adjacent to the emissionarea PXA. The non-emission area NPXA may surround the emission area PXA.In an embodiment, the emission area PXA may be defined to correspond toa portion of an area of the first electrode AE exposed by the openingOP.

A hole control layer HCL may be commonly disposed on the emission areaPXA and the non-emission area NPXA. The hole control layer HCL mayinclude a hole transport layer and may further include a hole injectionlayer. An emission layer EML is disposed on the hole control layer HCL.The emission layer EML may be disposed on an area corresponding to theopening OP. For instance, the emission layer EML may be formed to beseparated from each of the pixels PX.

An electron control layer ECL is disposed on the emission layer EML. Theelectron control layer ECL may include an electron transport layer andmay further include an electron injection layer. The hole control layerHCL and the electron control layer ECL may be commonly formed on theplurality of pixels PX using an open mask. A second electrode CE isdisposed on the electronic control layer ECL. The second electrode CE isprovided as a single body and commonly disposed on the plurality ofpixels PX (see FIG. 4).

As illustrated in FIGS. 5A and 5B, the upper insulation layer TFL isdisposed on the second electrode CE. The upper insulation layer TFL mayinclude a plurality of thin films. According to some embodiments, theupper insulation layer TFL may include a capping layer CPL and a thinfilm encapsulation layer TFE. The thin film encapsulation layer TFE mayinclude a first inorganic layer IOL1, an organic layer IOL2, and asecond inorganic layer IOL3.

The capping layer CPL is disposed on the second electrode CE to contactthe second electrode CE. The capping layer CPL may include an organicmaterial. The first inorganic layer IOL1 is disposed on the cappinglayer CPL to contact the capping layer CPL. The organic layer IOL2 isdisposed on the first inorganic layer IOL1 to contact the firstinorganic layer IOL1. The second inorganic layer IOL3 is disposed on theorganic layer IOL2 to contact the organic layer IOL2.

The capping layer CPL may protect the second electrode CE from afollow-up process, for example, a sputtering process, and may improveemission efficiency of the organic light emitting diode OLED. Thecapping layer CPL may have a refractive index greater than that of thefirst inorganic layer IOL1.

The first inorganic layer IOL1 and the second inorganic layer IOL3 mayprotect the display element layer DP-OLED against oxygen and/ormoisture, and the organic layer IOL2 may protect the display elementlayer DP-OLED against foreign substances, such as dust particles. Eachof the first inorganic layer IOL1 and the second inorganic layer IOL3may be at least one of a silicon oxide layer, a silicon nitride layer, asilicon oxynitride layer, and a silicon oxide layer. According to anembodiment, each of the first inorganic layer IOL1 and the secondinorganic layer IOL3 may include a titanium oxide layer, an aluminumoxide layer, and/or the like. The organic layer OL may include anacrylic-based organic layer, but is not limited thereto.

According to an embodiment, an inorganic layer, for example, a lithiumfluoride (LiF) layer, may be further disposed between the capping layerCPL and the first inorganic layer IOL1. The LiF layer may improveemission efficiency of the organic light emitting diode OLED.

FIG. 6 is a cross-sectional view of an input sensor according to someexemplary embodiments.

As illustrated in FIG. 6, the input sensor ISL may include a firstinsulation layer ISL-IL1 (hereinafter, referred to as a first inputinsulation layer), a first conductive layer ISL-CL1, a second insulationlayer ISL-IL2 (hereinafter, referred to as a second input insulationlayer), a second conductive layer ISL-CL2, and a third insulation layerISL-IL3 (hereinafter, referred to as a third input insulation layer).The first input insulation layer ISL-IL1 may be directly disposed on theupper insulation layer TFL. In an embodiment, the first input insulationlayer ISL-IL1 may be omitted.

Each of the first conductive layer ISL-CL1 and the second conductivelayer ISL-CL2 may have a single-layered structure or a multi-layeredstructure in which a plurality of layers are laminated in the thirddirectional axis DR3. A conductive layer having the multi-layeredstructure may include at least two of transparent conductive layers andmetal layers. The conductive layer having the multi-layered structuremay include metal layers including metals different from each other. Thetransparent conductive layer may at least one of include indium tinoxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zincoxide (ITZO), poly(3,4-ethylenedioxythiophene) (PEDOT), metal nano wire,and graphene. The metal layer may be formed of molybdenum, silver,titanium, copper, aluminum, and/or an alloy thereof. For example, eachof the first and second conductive layers ISL-CL1 and ISL-CL2 may have athree-layered metal structure, for example, a three-layered structure oftitanium/aluminum/titanium. A metal having relatively high durabilityand low reflectance may be applied to an outer layer, and a metal havinghigh electrical conductivity may be applied to an inner layer.

Each of the first and second conductive layers ISL-CL1 and ISL-CL2 mayinclude a plurality of patterns. Hereinafter, an example in which thefirst conductive layer ISL-CL1 includes first conductive patterns, andthe second conducive layer ISL-CL2 includes second conductive patternswill be described. As will become more apparent below, each of the firstand second conductive patterns ISL-CL1 and ISL-CL2 may include sensingelectrodes and signal lines connected to the sensing electrodes.

Each of the first to third input insulation layers ISL-IL1 to ISL-IL3may include an inorganic or organic layer. In an embodiment, each of thefirst input insulation layer ISL-IL1 and the second input insulationlayer ISL-IL2 may be an inorganic layer. The inorganic layer may includeat least one of oxide, titanium oxide, silicon oxide, silicon oxidenitride, zirconium oxide, and hafnium oxide. The third input insulationlayer ISL-IL3 may include an organic layer. The organic layer mayinclude at least one of an acrylic-based resin, a methacrylic-basedresin, a polyisoprene-based resin, a vinyl-based resin, an epoxy-basedresin, a urethane-based resin, a cellulose-based resin, a siloxane-basedresin, a polyimide-based resin, a polyamide-based resin, and aperylene-based resin.

FIG. 7A is a plan view of the input sensor ISL according to someexemplary embodiments. FIG. 7B is an enlarged view illustrating a firstarea AA of the input sensor ISL of FIG. 7A according to some exemplaryembodiments. FIGS. 7C, 7D, and 7E are partial cross-sectional views ofthe input sensor ISL according to various exemplary embodiments.

As illustrated in FIGS. 7A and 7B, the input sensor ISL may includefirst sensing electrodes IE1-1 to IE1-10, second sensing electrodesIE2-1 to IE2-8, first connection lines CNL1-1 to CNL1-5, secondconnection lines CNL2-1 to CNL2-4, first sensing lines SL1-1 to SL1-10,and second sensing lines SL2-1 to SL2-8. The input sensor ISL mayinclude a sensing area ISL-DA and a line area ISL-NDA, whichrespectively correspond to the display area DP-DA and the non-displayarea DP-NDA of the display panel DP. The sensing area ISL-DA may bedefined as an area on (or in) which the first sensing electrodes IE1-1to IE1-10 and the second sensing electrodes IE2-1 to IE2-8 are disposed.The first connection lines CNL1-1 to CNL1-5, the second connection linesCNL2-1 to CNL2-4, the first sensing lines SL1-1 to SL1-10, and thesecond sensing lines SL2-1 to SL2-8 are disposed on the line areaISL-NDA.

In an embodiment, the input sensor ISL may be a capacitive touch sensor.One of the first sensing electrodes IE1-1 to IE1-10 and the secondsensing electrodes IE2-1 to IE2-8 receives a driving signal, and theother outputs a variation in capacitance between the first sensingelectrodes IE1-1 to IE1-10 and the second sensing electrodes IE2-1 toIE2-8 as a sensing signal.

Each of the first sensing electrodes IE1-1 to IE1-10 may extend in thesecond direction DR2. Also, the first sensing electrodes IE1-1 to IE1-10may be sequentially arranged in the first direction DR1.

Each of the second sensing electrodes IE2-1 to IE2-8 may extend in thefirst direction DR1. Also, the second sensing electrodes IE2-1 to IE2-8may be sequentially arranged in the second direction DR2.

The first sensing lines SL1-1 to SL1-10 may include the same number ofsignal lines as the first sensing electrodes IE1-1 to IE1-10. The firstsensing lines SL1-1 to SL1-10 may be connected to at least one end ofboth ends of each of the first sensing electrodes IE1-1 to IE1-10. Thesecond sensing lines SL2-1 to SL2-8 may include the same number ofsignal lines as the second sensing electrodes IE2-1 to IE2-8. The secondsensing lines SL2-1 to SL2-8 may be connected to at least one end ofboth ends of each of the second sensing electrodes IE2-1 to IE2-8.

The first sensing lines SL1-1 to SL1-10 may be connected to some of theauxiliary lines SSL (see FIG. 4) disposed at one side of the pad areaNDA-PA through the contact holes CNT. The second sensing lines SL2-1 toSL2-8 may be connected to some of the auxiliary lines SSL (see FIG. 4)disposed on the other side of the pad area NDA-PA through the contactholes CNT.

The contact holes CNT may pass through the insulation layers disposedbetween the first sensing lines SL1-1 to SL1-10 and the second sensinglines SL2-1 to SL2-8 and the auxiliary lines SSL. The contact holes CNTpass through a portion of the first to sixth insulation layers 10 to 60(see FIG. 5A) and then pass through the first input insulation layerISL-IL1 (see FIG. 6) and the second input insulation layer ISL-IL2 (seeFIG. 6) of the input sensor ISL.

Each of the first sensing electrodes IE1-1 to IE1-10 includes aplurality of first sensing parts SP1 and a plurality of first connectionparts CP1. Each of the second sensing electrodes IE2-1 to IE2-8 includesa plurality of second sensing parts SP2 and a plurality of secondconnection parts CP2.

Each of the first connection lines CNL1-1 to CNL1-5 electricallyconnects two corresponding first sensing electrodes (hereinafter, pairof first sensing electrodes) to each other among the first sensingelectrodes IE1-1 to IE1-10. For example, the first connection lineCNL1-1 electrically connects the first sensing electrodes IE1-1 andIE1-2 to each other, and the second connection line CNL1-2 electricallyconnects the first sensing electrodes IE1-3 and IE1-4 to each other. Inthe example illustrated in FIG. 7A, the first connection lines CNL1-1 toCNL1-5 electrically connect the respective pairs of first sensingelectrodes adjacent to each other to each other among the first sensingelectrodes IE1-1 to 1E1-10, but embodiments are not limited thereto. Forexample, the first connection line CNL1-1 may electrically connect thefirst sensing electrodes IE1-1 and IE1-3, which are not adjacent to eachother, to each other.

The first connection lines CNL1-1 to CNL1-5 may be connected to theother ends of the first sensing electrodes IE1-1 to IE1-10, to which thefirst sensing lines SL1-1 to SL1-10 are not connected, among both (oropposing) ends of the first sensing electrodes IE1-1 to IE1-10,respectively. The first sensing lines SL1-1 to SL1-10 may be disposed onthe same layer with the same material as the first sensing parts SP1.

Each of the second connection lines CNL2-1 to CNL2-4 electricallyconnects two corresponding second sensing electrodes (hereinafter, pairof second sensing electrodes) to each other among the second sensingelectrodes IE2-1 to IE2-8. For example, the second connection lineCNL2-1 electrically connects the second sensing electrodes IE2-1 andIE2-2 to each other, and the first connection line CNL2-2 electricallyconnects the second sensing electrodes IE2-3 and IE2-4 to each other. Inthe example illustrated in FIG. 7A, the second connection lines CNL2-1to CNL2-4 electrically connect the respective pairs of first sensingelectrodes adjacent to each other to each other among the second sensingelectrodes IE2-1 to IE2-4, but embodiments are not limited thereto. Forexample, the second connection line CNL2-1 may electrically connect thesecond sensing electrodes IE2-1 and IE2-3, which are not adjacent toeach other, to each other.

The second connection lines CNL2-1 to CNL2-4 may be connected to theother ends of the second sensing electrodes IE2-1 to IE2-8, to which thesecond sensing lines SL2-1 to SL2-8 are not connected, among both (oropposing) ends of the second sensing electrodes IE2-1 to IE2-8,respectively. The second sensing lines SL2-1 to SL2-8 may be disposed onthe same layer with the same material as the second sensing parts SP2.

FIG. 7C is a cross-sectional view taken along sectional line I-I′ ofFIG. 7B according to some exemplary embodiments. FIG. 7C illustrates anexample in which the first connection part CP1 and the second connectionpart CP2 cross each other. In an embodiment, the first connection partCP1 may correspond to a bridge pattern. In another embodiment, thesecond connection part CP2 may be the bridge pattern.

As illustrated in FIGS. 7B and 7C, the plurality of first connectionparts CP1 may be formed from the first conductive layer ISL-CL1 (seeFIG. 6), and the plurality of first sensing parts SP1, the plurality ofsecond sensing parts SP2, and the plurality of second connection partsCP2 may be formed from the second conductive layer ISL-CL2. The firstsensing parts SP1 and the first connection part CP1 may be connected toeach other through contact holes CNT-IL2 passing through the secondinput insulation layer ISL-IL2.

In an embodiment, although the plurality of first connection parts CP1and the plurality of second connection parts CP2 cross each other,embodiments are not limited thereto. For example, each of the firstconnection parts CP1 may be formed into a “A”-shaped curved line and/ora “V”-shaped curved line so that the first connection parts CP1 do notoverlap the second connection parts CP2. The first connection parts CP1having the “A”-shaped curved line and/or a “V”-shaped curved line mayoverlap the second sensing parts SP2 on a plane.

According to some embodiments, the first sensing lines SL1-1 to SL1-10and the second sensing lines SL2-1 to SL2-8 include at least one of aportion disposed on the same layer as the first sensing electrodes IE1-1to IE1-10 or a portion disposed on the same layer as the second sensingelectrodes IE2-1 to IE2-8.

FIG. 7D is a cross-sectional view taken along sectional line II-IF ofFIG. 7A according to some exemplary embodiments. For instance, in FIG.7D, the first sensing lines SL1-9 and SL1-10 of the first sensing linesSL1-1 to SL1-10 are illustrated as an example. The first sensing linesSL1-1 to SL1-10 include at least portions disposed on the same layer asthe first sensing electrodes IE1-1 to IE1-10, e.g., the secondconductive layer ISL-CL2 (see FIG. 6). The first sensing lines SL1-1 toSL1-10 and the second sensing lines SL2-1 to SL2-8 may further includeportions formed from the first conductive layer ISL-CL1 (see FIG. 6).

Referring again to FIG. 7A, in a first sensing mode in which the firstinput TC1 (see FIG. 1) of the user is sensed, the first sensingelectrodes IE1-1 to IE1-10 and the second sensing electrodes IE2-1 toIE2-8 sense the first input TC1 of the user and output the sensedsignals to at least one of the first sensing lines SL1-1 to SL1-10 andthe second sensing lines SL2-1 to SL2-8.

In a second sensing mode in which the second input TC2 (see FIG. 1) ofthe electronic pen EP is sensed, the respective pairs of first sensingelectrodes lines IE1-1 to IE1-10 and the respective pairs of secondsensing electrodes lines IE2-1 to IE2-8 sense the second input TC2 andoutput the sensed signals to at least one of the first sensing linesSL1-1 to SL1-10 and the second sensing lines SL2-1 to SL2-8. In thesecond sensing mode, for example, a loop provided by the first sensingline SL1-1, the first sensing electrode IE1-1, the first connection lineCNL1-1, the first sensing electrode IE1-2, and the first sensing lineSL1-2 may resonate with a capacitor disposed inside the electronic penEP to emit electromagnetic force or receive touch information.

As illustrated in FIG. 7A, the input sensor ISL may further includefirst connection lines CNL1-1 to CNL1-5 and second connection linesCNL2-1 to CNL2-4 in addition to the first sensing electrodes IE1-1 toIE1-10 and the second sensing electrodes IE2-1 to IE2-8 so as to sensethe first input TC1 (see FIG. 1) of the user and to sense the secondinput TC2 (see FIG. 1) of the electronic pen EP. Accordingly, the inputsensor ISL and the display device DD (see FIG. 2) including the inputsensing ISL may be capable of sensing the first input TC1 and the secondinput TC2 of the user while minimizing (or at least reducing) anincrease in production cost.

FIG. 7E is a schematic view illustrating first sensing electrodes andsecond sensing electrodes of the input sensor of FIG. 7A according tosome exemplary embodiments. For instance, FIG. 7E schematicallyillustrates the first sensing electrodes IE1-1 to IE1-10 and the secondsensing electrodes IE2-1 to IE2-8 of the input sensor ISL illustrated inFIG. 7A, and will be utilized to explain the second sensing mode inwhich the second input TC2 of the electronic pen EP is sensed accordingto some exemplary embodiments.

Referring to FIGS. 7A and 7E, at least one of the first sensingelectrodes IE1-1 to IE1-10 and the second sensing electrodes IE2-1 toIE2-8 may operate as a driving coil through which current flows toinduce magnetic force lines, and the other of the first sensingelectrodes IE1-1 to IE1-10 and the second sensing electrodes IE2-1 toIE2-8 may operates as a sensing coil in which a voltage is induced bythe magnetic force lines.

For example, first coils C1-1 to C1-5 provided by the first sensinglines SL1-1 to SL1-10 and the first sensing electrodes IE1-1 to IE1-10may operate as driving coils. Second coils C2-1 to C2-4 provided by thesecond sensing lines SL2-1 to SL2-8 and the second sensing electrodesIE2-1 to IE2-8 may operate as sensing coils.

Each of the first coils C1-1 to C1-5 receives current from the secondsensing circuit EP-C (see FIG. 4) to form a current path in the form ofa closed loop. When the electronic pen EP (see FIG. 1) approaches one ofthe first coils C1-1 to C1-5, the capacitor within the electronic pen EPmay resonate to generate magnetic fields around the current path. Sincethe current flows through one of the second coils C2-1 to C2-4 by themagnetic fields, the second coils C2-1 to C2-4 may sense a change of thesignals received from the second sensing lines SL2-1 to SL2-8 to sensethe second input TC2 of the electronic pen EP.

For example, it will be assumed that the second input TC2 is inputted ata predetermined position (x, y). When current flows through the firstcoil C1-4 adjacent to the predetermined position (x, y), the magneticfields may resonate with the first coil C1-4 and the capacitor, which isdisposed inside the electronic pen EP, to generate magnetic fields. Thecurrent flows through the second coil C2-3 that crosses (e.g., isperpendicular to) the first coil C1-4 and adjacent to the predeterminedpositions (x, y). The second sensing circuit EP-C may sense a change incurrent flowing through the second sensing line SL2-5 and the secondsensing line SL2-6 to detect an input position (x, y) of the secondinput TC2.

FIG. 8A is a plan view of an input sensor ISL2 according to someexemplary embodiments. FIG. 8B is an enlarged view illustrating a secondarea BB of the input sensor ISL2 of FIG. 8A according to some exemplaryembodiments. FIGS. 8C, 8D, and 8E are partial cross-sectional views ofthe input sensor ISL2 according to various exemplary embodiments.Hereinafter, detailed descriptions with respect to the same constituentas described with reference to FIGS. 1 to 7E will be omitted.

As illustrated in FIGS. 8A and 8B, the input sensor ISL2 includes firstsensing electrodes IE1-1 to IE1-10, second sensing electrodes IE2-1 toIE2-8, first sensing lines SL1-1 through SL1-10, second sensing linesSL2-1 through SL2-8, third sensing lines SL3-1 through SL3-10, andfourth sensing lines SL4-1 to SL4-8. The input sensor ISL2 may include asensing area ISL-DA and a line area ISL-NDA that respectively correspondto the display area DP-DA and the non-display area DP-NDA of the displaypanel DP. The sensing area ISL-DA may be defined as an area on which thefirst sensing electrodes IE1-1 to IE1-10 and the second sensingelectrodes IE2-1 to IE2-8 are disposed. The first sensing lines SL1-1 toSL1-10, the second sensing lines SL2-1 to SL2-8, the third sensing linesSL3-1 to SL3-10, and the fourth sensing lines SL4-1 to SL4-8 aredisposed on the line area ISL-NDA.

Each of the first sensing electrodes IE1-1 to IE1-10 may extend in thesecond direction DR2. Also, the first sensing electrodes IE1-1 to IE1-10may be sequentially arranged in the first direction DR1. Each of thesecond sensing electrodes IE2-1 to IE2-8 may extend in the firstdirection DR1. Also, the second sensing electrodes IE2-1 to IE2-8 may besequentially arranged in the second direction DR2.

The first sensing lines SL1-1 to SL1-10 may include the same number ofsignal lines as the number of the first sensing electrodes IE1-1 toIE1-10. The first sensing lines SL1-1 to SL1-10 may be connected to atleast one end of both ends of each of the first sensing electrodes IE1-1to IE1-10. The second sensing lines SL2-1 to SL2-8 may include the samenumber of signal lines as the number of the second sensing electrodesIE2-1 to IE2-8. The second sensing lines SL2-1 to SL2-8 may be connectedto at least one end of both ends of each of the second sensingelectrodes IE2-1 to IE2-8.

The first sensing lines SL1-1 to SL1-10 may be connected to some of theauxiliary lines SSL (refer to FIG. 4) disposed at (or near) one side ofthe pad area NDA-PA through the contact holes CNT. The second sensinglines SL2-1 to SL2-8 may be connected to some of the auxiliary lines SSL(see FIG. 4) disposed at the other side of the pad area NDA-PA throughthe contact holes CNT.

The contact holes CNT may pass through the insulation layers disposedbetween the first sensing lines SL1-1 to SL1-10 and the second sensinglines SL2-1 to SL2-8 and the auxiliary lines SSL. For instance, thecontact holes CNT may pass through a portion of the first to sixthinsulation layers 10 to 60 (see FIG. 5A) and then may pass through thefirst input insulation layer ISL-IL1 and the second input insulationlayer ISL-IL2 of the input sensor ISL (see FIG. 6).

Each of the first sensing electrodes IE1-1 to IE1-10 includes aplurality of first sensing parts SP1 and a plurality of first connectionparts CP1. Each of the plurality of first sensing parts SP1 includes afirst sub-sensor part SSP1, a second sub-sensor part SSP2, and a firstsub-connection part SCP1. The first sub-sensor part SSP1 and the secondsub-sensor part SSP2 are spaced apart from each other in the seconddirection DR2. The first sub-connection part SCP1 electrically connectsthe first sub-sensor part SP1 to the second sub-sensor part SP2. A widthand shape of the first sub-connection part SCP1 in the first directionDR1 are not limited to those illustrated in FIG. 8B and may be variouslychanged. For example, the first sub-connection part SCP1 may include aplurality of bridges arranged in parallel and spaced apart from eachother in the first direction DR1 between the first sub-sensor part SSP1and the second sub-sensor part SSP2.

Each of the second sensing electrodes IE2-1 to IE2-8 includes aplurality of second sensing parts SP2 and a plurality of secondconnection parts CP2. Each of the plurality of second sensing parts SP2includes a third sub-sensor part SSP3, a fourth sub-sensor part SSP4,and a second sub-connection part SCP2. The third sub-sensor part SSP3and the fourth sub-sensor part SSP4 are disposed to be spaced apart inthe first direction DR1. The second sub-connection part SCP2electrically connects the third sub-sensor part SSP3 to the fourthsub-sensor part SSP4. A width and shape of the second sub-connectionpart SCP2 in the second direction DR2 are not limited to thoseillustrated in FIG. 8B and may be variously changed. For example, thesecond sub-connection part SCP2 may include a plurality of bridgesarranged in parallel and spaced apart from each other in the seconddirection DR2 between the third sub-sensor part SSP3 and the fourthsub-sensor part SSP4.

The third sensing lines SL3-1 to SL3-10 may include the same number ofsignal lines as the number of the first sensing electrodes IE1-1 toIE1-10. The third sensing lines SL3-1 to SL3-10 are disposed between thethird sub-sensor part SSP3 and the fourth sub-sensor part SSP4 of thesecond sensing parts SP2, respectively. Ends of the two correspondingthird sensing lines (hereinafter, a pair of third sensing lines) amongthe third sensing lines SL3-1 to SL3-10 are electrically connected toeach other. For example, ends of the third sensing lines SL3-1 andSL3-2, which are the pair of third sensing lines, are electricallyconnected to each other to provide a loop shape.

The fourth sensing lines SL4-1 to SL4-8 may include the same number ofsignal lines as the second sensing electrodes IE2-1 to IE2-8. The fourthsensing lines SL4-1 to SL4-8 are disposed between the first sub-sensorpart SSP1 and the second sub-sensor part SSP2 of the first sensing partsSP1, respectively. Two corresponding fourth sensing lines (hereinafter,a pair of fourth sensing lines) among the fourth sensing lines SL4-1 toSL4-8 are electrically connected to each other. Ends of the pair offourth sensing lines among the fourth sensing lines SL4-1 to SL4-8 areelectrically connected to each other. For example, ends of the fourthsensing lines SL4-1 and SL4-2, which are the pair of fourth sensinglines, are electrically connected to each other to provide a loop shape.

The third sensing lines SL3-1 to SL3-10 may be connected to some of theauxiliary lines SSL (see FIG. 4) disposed at one side of the pad areaNDA-PA through the contact holes CNT. The fourth sensing lines SL4-1 toSL4-8 may be connected to some of the auxiliary lines SSL (see FIG. 4)disposed at the other side of the pad area NDA-PA through the contactholes CNT.

The contact holes CNT may pass through the insulation layers disposedbetween the third sensing lines SL3-1 to SL3-10 and the fourth sensinglines SL4-1 to SL4-8 and the auxiliary lines SSL. For instance, thecontact holes CNT may pass through a portion of the first to sixthinsulation layers 10 to 60 (see FIG. 5A) and then may pass through thefirst input insulation layer ISL-IL1 (see FIG. 6) and the second inputinsulation layer ISL-IL2 of the input sensor ISL (see FIG. 6).

FIG. 8C is a cross-sectional view taken along sectional line of FIG. 8Baccording to some exemplary embodiments. FIG. 8D is a cross-sectionalview taken along sectional line IV-IV′ of FIG. 8B according to someexemplary embodiments. FIG. 8E is a cross-sectional view taken alongsectional line V-V′ of FIG. 8A according to some exemplary embodiments.It is noted that FIGS. 8C to 8E illustrate an example in which the firstconnection part CP1 and the second connection part CP2 cross each other.As seen in FIGS. 8C to 8E, the first connection part CP1 may correspondto a bridge pattern, but in another embodiment, the second connectionpart CP2 may be the bridge pattern.

Referring to FIGS. 8B, 8C, 8D, and 8E, the plurality of first connectionparts CP1, the plurality of first sub-connection parts SCP1, and theplurality of second sub-connection parts SCP2 may be formed from thefirst conductive layer ISL-CL1 (see FIG. 6), and the plurality of firstsensing parts SP1, the plurality of second sensing parts SP2, and theplurality of second connection parts CP2 may be formed from the secondconductive layer ISL-CL2. The first sensing parts SP1 and the firstconnection part CP1 may be connected to each other through contact holesCNT-IL2 passing through the second input insulation layer ISL-IL2. Theplurality of first connection parts CP1 may be formed from the firstconductive layer ISL-CL1 (see FIG. 6), and the plurality of firstsensing parts SP1, the plurality of second sensing parts SP2, and theplurality of second connection parts CP2 may be formed from the secondconductive layer ISL-CL2. The first sensing parts SP1 and the firstconnection part CP1 may be connected to each other through contact holesCNT-IL2 passing through the second input insulation layer ISL-IL2.

In an embodiment, although the plurality of first connection parts CP1and the plurality of second connection parts CP2 cross each other,embodiments are not limited thereto. For example, each of the firstconnection parts CP1 may be deformed into a “A”-shaped curved lineand/or a “V”-shaped curved line so that the first connection parts CP1do not overlap the second connection parts CP2. The first connectionparts CP1 having the “A”-shaped curved line and/or the “V”-shaped curvedline may overlap the second sensing parts SP2 on a plane.

As shown in FIG. 8C, the first sub-sensor parts SSP1 and the firstsub-connection parts SCP1 may be connected to each other through firstsub-contact holes SCNT1 passing through the second input insulationlayer ISL-IL2. The second sub-sensor parts SSP2 and the firstsub-connection parts SCP1 may be connected to each other through secondsub-contact holes SCNT2 passing through the second input insulationlayer ISL-IL2. Also, the first sub-sensor parts SSP1 and the firstconnection part CP1 may be connected to each other through thirdsub-contact holes SCNT3 passing through the second input insulationlayer ISL-IL2. As described above, the first sub-sensor parts SSP1 andthe second sub-sensor parts SSP2 may be electrically connected to eachother by the first sub-connection part SCP1 and the first connectionpart CP1. Also, the first sub-sensor parts SSP1 and the fourth sensinglines SL4-1 to SL 4-8 may be insulated from each other by the secondinput insulation layer ISL-IL2.

As illustrated in FIG. 8D, the third sub-sensor parts SSP3 and thesecond sub-connection parts SCP2 may be connected to each other throughfourth sub-contact holes SCNT4 passing through the second inputinsulation layer ISL-IL2. Also, the fourth sub-sensor parts SSP4 and thesecond sub-connection parts SCP2 may be connected to each other throughfifth sub-contact holes SCNT5 passing through the second inputinsulation layer ISL-IL2. As described above, the third sub-sensor partsSSP3 and the fourth sub-sensor parts SSP4 may be electrically connectedto each other by the second sub-connection part SCP2. Also, the thirdsub-sensor part SSP3 and the fourth sub-sensor parts SSP4 may beinsulated from each other by the second input insulation layer ISL-IL2.

As illustrated in FIG. 8E, the fourth sensing line SL4-1 and the thirdsub-connection part SCP3 are connected to each other through a sixthsub-contact hole SCNT6 passing through the second input insulation layerISL-IL2. Also, the third sub-connection part SCP3 and the fourth sensingline SL4-1 may be connected to each other through a seventh sub-contacthole SCNT7 passing through the second input insulation layer ISL-IL2. Asdescribed above, the fourth sensing line SL4-1 may be electricallyconnected by the third sub-connection part SCP3. Also, the third sensinglines SL3-1 to SL3-10 and the fourth sensing lines SL4-1 to SL4-8 may beinsulated from each other by the second input insulation layer ISL-IL2.

According various embodiments, the first sensing lines SL1-1 to SL1-10and the second sensing lines SL2-1 to SL2-8 include at least one of aportion disposed on the same layer as the first sensing electrodes IE1-1to IE1-10 or a portion disposed on the same layer as the second sensingelectrodes IE2-1 to IE2-8.

Referring again to FIG. 8A, in a first sensing mode in which the firstinput TC1 (see FIG. 1) of the user is sensed, the first sensingelectrodes IE1-1 to IE1-10 and the second sensing electrodes IE2-1 toIE2-8 sense the first input TC1 of the user and output the sensedsignals to at least one of the first sensing lines SL1-1 to SL1-10 andthe second sensing lines SL2-1 to SL2-8.

In the second sensing mode in which the second input TC2 (see FIG. 1) ofthe electronic pen EP is sensed, a pair of third sensing lines of thethird sensing lines SL3-1 to SL3-10 and a pair of fourth sensing linesof the fourth sensing lines SL4-1 to SL4-8 sense the second input TC2 tooutput the sensed signals to at least one of the third sensing linesSL3-1 to SL3-10 and the fourth sensing lines SL4-1 to SL4-8. In thesecond sensing mode, for example, a loop provided by the third sensingline SL3-1 or SL3-2, which is one of a pair of third sensing lines, mayresonant with the capacitor, which is disposed inside the electronic penEP, to emit electromagnetic force or receive touch information.

As illustrated in FIG. 8A, the input sensor ISL2 may further includethird sensing lines SL3-1 to SL3-10 and fourth sensing lines SL4-1 toSL4-8 in addition to the first sensing electrodes IE1-1 to IE1-10 andthe second sensing electrodes IE2-1 to IE2-8 so as to sense the firstinput TC1 (see FIG. 1) and to sense the second input TC2 (see FIG. 1) ofthe electronic pen EP. Furthermore, since the third sensing lines SL3-1to SL3-10 and the fourth sensing lines SL4-1 to SL4-8 are formed fromthe first conductive layer ISL-CL1 and the second conductive layerISL-CL2, which are the same layers as the first sensing electrodes IE1-1to IE1-10 and the electrodes IE2-1 to IE2-8, the input sensor ISL andthe display device DD (see FIG. 2) including the input sensor ISL may becapable of sensing the first input TC1 of the user and the second inputTC2 of the electronic pen EP, while minimizing (or at least reducing) anincrease in production cost.

The third sensing lines SL3-1 to SL3-10 are respectively disposedbetween the third sub-sensor parts SSP3 and the fourth sub-sensor partsSSP4 of the second sensing parts SP2 so as not to overlap the secondconnection parts CP2 of the second sensing parts SP2. Thus,short-circuit failure due to the overlapping of the third sensing linesSL3-1 to SL3-10 and the second connection parts CP2 may be prevented.Also, since each of the third sensing lines SL3-1 to SL3-10 is disposedbetween the third sub-sensor parts SSP3 and the fourth sub-sensor partsSSP4 of the second sensing parts SP2, an effect due to a signalinference or electrostatic discharge (ESD) between the third and fourthsub-sensor parts SSP3 and SSP4 and the third sensing lines SL3-1 toSL3-10 may be minimized or at least reduced.

The fourth sensing lines SL4-1 to SL4-10 are respectively disposedbetween the first sub-sensor part SSP1 and the second sub-sensor partSSP2 of the first sensing parts SP1 so as not to overlap the firstconnection part CP1 of the first sensor part SP1. Thus, short-circuitfailure due to the overlapping of the fourth sensing lines SL4-1 toSL4-8 and the first connection part CP1 may be prevented. Also, sinceeach of the fourth sensing lines SL4-1 to SL4-8 is disposed between thefirst sub-sensor part SSP1 and the second sub-sensor part SSP2 of thefirst sensing parts SP1, an effect due to a signal inference orelectrostatic discharge (ESD) between the first and second sensor partsSSP1 and SSP2 of the first sensing parts SP1 and the fourth sensinglines SL4-1 to SL4-8 may be minimized.

FIG. 9A is a plan view of an input sensor ISL3 according to someexemplary embodiments. FIG. 9B is an enlarged view illustrating a thirdarea CC of the input sensor ISL3 of FIG. 9A according to some exemplaryembodiments. FIGS. 9C, 9D, and 9E are partial cross-sectional views ofthe input sensor ISL3 according to various exemplary embodiments.

As illustrated in FIGS. 9A and 9B, the input sensor ISL3 includes firstsensing electrodes IE1-1 to IE1-10, second sensing electrodes IE2-1 toIE2-8, first sensing lines SL1-1 to SL1-10, second sensing lines SL2-1to SL2-8, third sensing lines SL3-1 to SL3-10, and fourth sensing linesSL4-1 to SL4-8. The input sensor ISL3 may include a sensing area ISL-DAand a line area ISL-NDA that respectively correspond to the display areaDP-DA and the non-display area DP-NDA of the display panel DP. Thesensing area ISL-DA may be defined as an area on which the first sensingelectrodes IE1-1 to IE1-10 and the second sensing electrodes IE2-1 toIE2-8 are disposed. The first sensing lines SL1-1 to SL1-10, the secondsensing lines SL2-1 to SL2-8, the third sensing lines SL3-1 to SL3-10,and the fourth sensing lines SL4-1 to SL4-8 are disposed on the linearea ISL-NDA.

Each of the first sensing electrodes IE1-1 to IE1-10 may extend in thesecond direction DR2. Also, the first sensing electrodes IE1-1 to IE1-10may be sequentially arranged in the first direction DR1. Each of thesecond sensing electrodes IE2-1 to IE2-8 may extend in the firstdirection DR1. Also, the second sensing electrodes IE2-1 to IE2-8 may besequentially arranged in the second direction DR2.

The first sensing lines SL1-1 to SL1-10 may include the same number ofsignal lines as the number of the first sensing electrodes IE1-1 toIE1-10. The first sensing lines SL1-1 to SL1-10 may be connected to atleast one end of both ends of each of the first sensing electrodes IE1-1to IE1-10. The second sensing lines SL2-1 to SL2-8 may include the samenumber of signal lines as the number of the second sensing electrodesIE2-1 to IE2-8. The second sensing lines SL2-1 to SL2-8 may be connectedto at least one end of both ends of each of the second sensingelectrodes IE2-1 to IE2-8.

The first sensing lines SL1-1 to SL1-10 may be connected to some of theauxiliary lines SSL (refer to FIG. 4) disposed at one side of the padarea NDA-PA through the contact holes CNT. The second sensing linesSL2-1 to SL2-8 may be connected to some of the auxiliary lines SSL (seeFIG. 4) disposed on the other side of the pad area NDA-PA through thecontact holes CNT.

The contact holes CNT may pass through the insulation layers disposedbetween the first sensing lines SL1-1 to SL1-10 and the second sensinglines SL2-1 to SL2-8 and the auxiliary lines SSL. The contact holes CNTmay pass through a portion of the first to sixth insulation layers 10 to60 (see FIG. 5A) and then may pass through the first input insulationlayer ISL-IL1 and the second input insulation layer ISL-IL2 of the inputsensor ISL (see FIG. 6).

Each of the first sensing electrodes IE1-1 to IE1-10 includes aplurality of first sensing parts SP1 and a plurality of first connectionparts CP1. Each of the plurality of first sensing parts SP1 includes afirst sub-sensor part SSP1, a second sub-sensor part SSP2, and a firstsub-connection part SCP1. The first sub-sensor part SSP1 and the secondsub-sensor part SSP2 are spaced apart from each other in the seconddirection DR2. The first sub-connection part SCP1 electrically connectsthe first sub-sensor part SP1 to the second sub-sensor part SP2. A widthand shape of the first sub-connection part SCP1 in the first directionDR1 are not limited to those illustrated in FIG. 8B and may be variouslychanged. For example, the first sub-connection part SCP1 may include aplurality of bridges arranged in parallel and spaced apart from eachother in the first direction DR1 between the first sub-sensor parts SSP1and the second sub-sensor parts SSP2.

Each of the second sensing electrodes IE2-1 to IE2-8 includes aplurality of second sensing parts SP2 and a plurality of secondconnection parts CP2. Each of the plurality of second sensing parts SP2includes a third sub-sensor part SSP3, a fourth sub-sensor part SSP4,and a second sub-connection part SCP2. The third sub-sensor part SSP3and the fourth sub-sensor part SSP4 are disposed to be spaced apart inthe first direction DR1. The second sub-connection part SCP2electrically connects the third sub-sensor part SSP3 to the fourthsub-sensor part SSP4. A width and shape of the second sub-connectionpart SCP2 in the second direction DR2 are not limited to thoseillustrated in FIG. 8B and may be variously changed. For example, thesecond sub-connection part SCP2 may include a plurality of bridgesarranged in parallel and spaced apart from each other in the seconddirection DR2 between the third sub-sensor parts SSP3 and the fourthsub-sensor parts SSP4.

The third sensing lines SL3-1 to SL3-10 may include the same number ofsignal lines as the number of the first sensing electrodes IE1-1 toIE1-10. The third sensing lines SL3-1 to SL3-10 are disposed between thethird sub-sensor parts SSP3 and the fourth sub-sensor parts SSP4 of thesecond sensing parts SP2, respectively. One end of each of the thirdsensing lines SL3-1 to SL3-10 is connected to the other end of thecorresponding first sensing electrode of the first sensing electrodesIE1-1 to IE1-10. Therefore, one first sensing line of the first sensinglines SL1-1 to SL1-10, one first sensing electrode of the first sensingelectrodes IE1-1 to IE1-10, and one third sensing line of the thirdsensing lines SL3-1 to SL3-10 may provide a signal path having a loopshape. For example, the first sensing line SL1-1, the first sensingelectrode IE1-1, and the third sensing line SL3-1 may provide aloop-shaped signal path to sense the second input TC2 of the electronicpen EP (see FIG. 1).

The fourth sensing lines SL4-1 to SL4-8 may include the same number ofsignal lines as the number of the second sensing electrodes IE2-1 toIE2-8. The fourth sensing lines SL4-1 to SL4-8 are disposed between thefirst sub-sensor parts SSP1 and the second sub-sensor parts SSP2 of thefirst sensing parts SP1, respectively. One end of each of the fourthsensing lines SL4-1 to SL4-8 is connected to the other end of thecorresponding second sensing electrode of the second sensing electrodesIE2-1 to IE2-8. Therefore, one second sensing line of the second sensinglines SL2-1 to SL2-8, one second sensing electrode of the second sensingelectrodes IE2-1 to IE2-8, and one fourth sensing line of the fourthsensing lines SL4-1 to SL4-8 may provide a signal path having a loopshape. For example, the second sensing line SL2-1, the second sensingelectrode IE2-1, and the fourth sensing line SL4-1 may provide aloop-shaped signal path to sense the second input TC2 of the electronicpen EP (see FIG. 1).

The third sensing lines SL3-1 to SL3-10 may be connected to some of theauxiliary lines SSL (see FIG. 4) disposed at one side of the pad areaNDA-PA (see FIG. 4) through the contact holes CNT. The fourth sensinglines SL4-1 to SL4-8 may be connected to some of the auxiliary lines SSL(see FIG. 4) disposed at the other side of the pad area NDA-PA throughthe contact holes CNT.

The contact holes CNT may pass through the insulation layers disposedbetween the third sensing lines SL3-1 to SL3-10 and the fourth sensinglines SL4-1 to SL4-8 and the auxiliary lines SSL. For instance, thecontact holes CNT may pass through a portion of the first to sixthinsulation layers 10 to 60 (see FIG. 5A) and then may pass through thefirst input insulation layer ISL-IL1 (see FIG. 6) and the second inputinsulation layer ISL-IL2 of the input sensor ISL (see FIG. 6).

FIG. 9C is a cross-sectional view taken along sectional line VI-VI′ ofFIG. 9B according to some exemplary embodiments. FIG. 9D is across-sectional view taken along sectional line VI-VI′ of FIG. 9Baccording to some exemplary embodiments. FIG. 9E is a cross-sectionalview taken along sectional line VII-VII′ of FIG. 9B according to someexemplary embodiments. For instance, FIGS. 9C to 9E illustrate anexample in which the first connection part CP1 and the second connectionpart CP2 cross each other. In an embodiment, the first connection partCP1 may correspond to a bridge pattern, but in another embodiment, thesecond connection part CP2 may be the bridge pattern.

Referring to FIGS. 9B to 9E, a plurality of first connection parts CP1,a plurality of first sub-connection parts SCP1, and a plurality ofsecond sub-connection parts SCP2 may be formed from the first conductivelayer ISL-CL1 (see FIG. 6), and the plurality of first sensing partsSP1, a plurality of second sensing parts SP2, and a plurality of secondconnection parts CP2 may be formed from the second conductive layerISL-CL2. The first sensing parts SP1 and the first connection parts CP1may be connected to each other through contact holes CNT-IL2 passingthrough the second input insulation layer ISL-IL2. The plurality offirst connection parts CP1 may be formed from the first conductive layerISL-CL1 (see FIG. 6), and the plurality of first sensing parts SP1, theplurality of second sensing parts SP2, and the plurality of secondconnection parts CP2 may be formed from the second conductive layerISL-CL2. The first sensing parts SP1 and the first connection parts CP1may be connected to each other through contact holes CNT-IL2 passingthrough the second input insulation layer ISL-IL2.

In an embodiment, although the plurality of first connection parts CP1and the plurality of second connection parts CP2 cross each other,embodiments are not limited thereto. For example, each of the firstconnection parts CP1 may be deformed into a “A”-shaped curved lineand/or a “V”-shaped curved line so that the first connection parts CP1do not overlap the second connection parts CP2. The first connectionparts CP1 having the “A”-shaped curved line and/or the “V”-shaped curvedline may overlap the second sensing parts SP2 on a plane.

As shown in FIG. 9C, the first sub-sensor parts SSP1 and the firstsub-connection parts SCP1 may be connected to each other through firstsub-contact holes SCNT11 passing through the second input insulationlayer ISL-IL2. The second sub-sensor parts SSP2 and the firstsub-connection parts SCP1 may be connected to each other through secondsub-contact holes SCNT12 passing through the second input insulationlayer ISL-IL2. The first sub-sensor parts SSP1 and the first connectionparts CP1 may be connected to each other through third sub-contact holesSCNT12 passing through the second input insulation layer ISL-IL2. Asdescribed above, the first sub-sensor parts SSP1 and the secondsub-sensor parts SSP2 may be electrically connected to each other by thefirst sub-connection parts SCP1 and the first connection parts CP1.Also, the first sub-sensor parts SSP1 and the fourth sensing lines SL4-1to SL4-8 may be insulated from each other by the second input insulationlayer ISL-IL2.

According some embodiments, the first sensing lines SL1-1 to SL1-10 andthe second sensing lines SL2-1 to SL2-8 include at least one of aportion disposed on the same layer as the first sensing electrodes IE1-1to IE1-10 or a portion disposed on the same layer as the second sensingelectrodes IE2-1 to IE2-8.

As illustrated in FIG. 9D, the third sub-sensor parts SSP3 and thesecond sub-connection parts SCP2 may be connected to each other throughfourth sub-contact holes SCNT14 passing through the second inputinsulation layer ISL-IL2. The fourth sub-sensor parts SSP4 and thesecond sub-connection parts SCP2 may be connected to each other throughfifth sub-contact holes SCNT15 passing through the second inputinsulation layer ISL-IL2. As described above, the third sub-sensor partsSSP3 and the fourth sub-sensor parts SSP4 may be electrically connectedto each other by the second sub-connection parts SCP2. Also, the thirdsub-sensor part SSP3 and the fourth sub-sensor parts SSP4 may beinsulated from each other by the second input insulation layer ISL-IL2.

As illustrated in FIG. 9E, the third sensing lines (e.g., the thirdsensing line SL3-9) and the fourth sub-connection parts SCP4 may beconnected to each other through sixth sub-contact holes SCNT16 passingthrough the second input insulation layer ISL-IL2. Also, the secondsub-sensor parts SSP2 and the fourth sub-connection parts SCP4 may beconnected to each other through seventh sub-contact holes SCNT17 passingthrough the second input insulation layer ISL-IL2. As described above,the third sensing lines SL3-1 to SL3-9 may be electrically connected tothe second sub-sensor parts SSP2 by the fourth sub-connection part SCP4.Also, two adjacent third sensing lines (e.g., third sensing lines SL3-9and SL3-10) of the third sensing lines SL3-1 to SL3-10 may be insulatedfrom each other by the second input insulation layer ISL-IL2.

In FIG. 9A, a portion of the first sensing lines SL1-1 to SL1-10 and aportion of the third sensing lines SL3-1 to SL3-10 may cross each otheron the line area ISL-NDA. In this case, as illustrated in FIG. 9E, oneof the first sensing lines SL1-1 to SL1-10 and the third sensing linesSL3-1 to SL3-10 may be connected to the bridge pattern through thesub-connection part, such as the fourth sub-connection part SCP4. Also,the first sensing lines SL1-1 to SL1-10 and the third sensing linesSL3-1 to SL3-10 may be insulated from each other by the second inputinsulation layer ISL-IL2. Referring again to FIG. 9A, in a first sensingmode in which the first input TC1 (see FIG. 1) of the user is sensed,the first sensing electrodes IE1-1 to IE1-10 and the second sensingelectrodes IE2-1 to IE2-8 sense the first input TC1 of the user andoutput the sensed signals to at least one of the first sensing linesSL1-1 to SL1-10 and the second sensing lines SL2-1 to SL2-8.

In a second sensing mode in which the second input TC2 (see FIG. 1) ofthe electronic pen EP is sensed, one first sensing line of the firstsensing lines SL1-1 to SL1-10, one first sensing electrode of the firstsensing electrodes IE1-1 to IE1-10, and one third sensing line of thethird sensing lines SL3-1 to SL3-10 may sense the second input TC2.Also, in the second sensing mode, one second sensing line of the secondsensing lines SL2-1 to SL2-8, one second sensing electrode of the secondsensing electrodes IE2-1 to IE2-8, and one fourth sensing line of thefourth sensing lines SL4-1 to SL4-8 may sense the second input TC2.

As illustrated in FIG. 9A, the input sensor ISL3 may further includethird sensing lines SL3-1 to SL3-10 and fourth sensing lines SL4-1 toSL4-8 in addition to the first sensing electrodes IE1-1 to IE1-10 andthe second sensing electrodes IE2-1 to IE2-8 so as to sense the firstinput TC1 (see FIG. 1) and the second input TC2 (see FIG. 1) of theelectronic pen EP.

Since the third sensing lines SL3-1 to SL3-10 and the fourth sensinglines SL4-1 to SL4-8 are formed from the first conductive layer ISL-CL1and the second conductive layer ISL-CL2, which are the same as the firstsensing electrodes IE1-1 to IE1-10 and the electrodes IE2-1 to IE2-8,the input sensor ISL3 and the display device DD (see FIG. 2) includingthe input sensor ISL3 may be capable of sensing the first input TC1 ofthe user and the second input TC2 of the electronic pen EP, whileminimizing or at least reducing an increase in production cost.

The third sensing lines SL3-1 to SL3-10 are respectively disposedbetween the third sub-sensor parts SSP3 and the fourth sub-sensor partsSSP4 of the second sensing parts SP2 so as not to overlap the secondconnection parts CP2 of the second sensing parts SP2. Thus,short-circuit failure due to the overlapping of the third sensing linesSL3-1 to SL3-10 and the second connection parts CP2 may be prevented.Also, since each of the third sensing lines SL3-1 to SL3-10 is disposedbetween the third sub-sensor parts SSP3 and the fourth sub-sensor partsSSP4 of the second sensing parts SP2, an effect due to a signalinference or electrostatic discharge (ESD) between the third and fourthsub-sensor parts SSP3 and SSP4 and the third sensing lines SL3-1 toSL3-10 may be minimized or at least reduced.

The fourth sensing lines SL4-1 to SL4-10 are respectively disposedbetween the first sub-sensor parts SSP1 and the second sub-sensor partsSSP2 of the first sensing parts SP1 so as not to overlap the firstconnection parts CP1 of the first sensing parts SP1. Thus, short-circuitfailure due to the overlapping of the fourth sensing lines SL4-1 toSL4-8 and the first connection parts CP1 may be prevented. Also, sinceeach of the fourth sensing lines SL4-1 to SL4-8 is disposed between thefirst sub-sensor parts SSP1 and the second sub-sensor parts SSP2 of thefirst sensing parts SP1, an effect due to a signal inference orelectrostatic discharge (ESD) between the first and second sub-sensorparts SSP1 and SSP2 of the first sensing parts SP1 and the fourthsensing lines SL4-1 to SL4-8 may be minimized or at least reduced.

Also, in the input sensor ISL3 illustrated in FIG. 9A, the first sensingelectrodes IE1-1 to IE1-10 and the second sensing electrodes IE2-1 toIE2-8 are used as a portion of the signal path for sensing the secondinput TC2. Accordingly, the input sensor ISL3 illustrated in FIG. 9A hashigher detection resolution of the second input TC2 in the same areathan that of the input sensor ISL2 described in association with FIG. 8.

FIG. 10 is a plan view of an input sensor ISL4 according to someexemplary embodiments.

Since the input sensor ISL4 illustrated in FIG. 10 has a configurationsimilar to that of the input sensor ISL3 described in association withFIG. 9A, duplicated descriptions will be omitted.

One end of a k-th third sensing line SL3-k of the third sensing linesSL3-1 to SL3-10 of the input sensor ISL3 described in association withFIG. 9A is connected to the other end of a k-th first sensing electrodeIE1-k of the first sensing electrodes IE1-1 to IE1-10. The k-th thirdsensing line SL3-k is disposed between the third sub-sensing part SSP3(see FIG. 9B) and the fourth sub-sensing part SSP4 (see FIG. 9B) of eachof the second sensing electrodes IE2-1 to IE2-8 disposed between a(k−1)-th first sensing electrode IE1-(k−1) and a (k−2)-th first sensingelectrode IE1-(k−2). For example, one end of the tenth, third sensingline SL3-10 of the input sensor ISL3 is connected to the other end ofthe tenth, first sensing electrode IE1-10. The tenth, third sensing lineSL3-10 is disposed between the third sub-sensing parts SSP3 and thefourth sub-sensing parts SSP4 of each of the second sensing electrodesIE2-1 to IE2-8 disposed between a ninth, first sensing electrode IE1-9and an eighth, first sensing electrode IE1-8. The second, third sensingline SL3-2 of the input sensor ISL3 described in association with FIG.9A may be disposed at one side of the first, first sensing electrodesIE1-1. The first, third sensing line SL3-1 of the input sensor ISL3described in association with FIG. 9A may be disposed at one side of thefirst, first sensing electrodes WM.

One end of a k-th fourth sensing line SL4-k of the fourth sensing linesSL4-1 to SL4-8 of the input sensor ISL3 described in association withFIG. 9A is connected to the other end of a k-th second sensing electrodeIE2-k of the second sensing electrodes IE2-1 to IE2-8. The k-th fourthsensing line SL4-k is disposed between the first sub-sensing parts SSP1(see FIG. 9B) and the second sub-sensing parts SSP2 (see FIG. 9B) ofeach of the first sensing electrodes IE1-1 to IE1-10 disposed between a(k+1)-th second sensing electrode IE2-(k+1) and a (k+2)-th secondsensing electrode IE2-(k+2). For example, one end of the first, fourthsensing line SL4-1 of the input sensor ISL3 is connected to the otherend of the first, second sensing electrode IE2-1. The first, fourthsensing line SL4-1 is disposed between the first sub-sensing parts SSP1and the second sub-sensing parts SSP2 of each of the first sensingelectrodes IE1-1 to IE1-10 disposed between a second, second sensingelectrode IE2-2 and a third, second sensing electrode IE2-3. Theseventh, third sensing line SL3-7 of the input sensor ISL3 described inassociation with FIG. 9A is disposed at one side of the eighth, secondsensing electrode IE2-8. The eighth, fourth sensing line SL4-8 of theinput sensor ISL3 described in association with FIG. 9A is disposed atone side of the eighth, second sensing electrode IE2-8.

One end of the k-th third sensing line SL3-k of the third sensing linesSL3-1 to SL3-10 of the input sensor ISL4 described in association withFIG. 10 is connected to the other end of the k-th first sensingelectrode IE1-k of the first sensing electrodes IE1-1 to IE1-10. Thek-th third sensing line SL3-k is disposed between the third sub-sensingparts SSP3 and the fourth sub-sensing parts SSP4 of each of the secondsensing electrodes IE2-1 to IE2-8 disposed between a k-th first sensingelectrode IE1-k and a (k+1)-th first sensing electrode IE1-(k+1). Thethird sub-sensor parts SSP3 and the fourth sub-sensor parts SSP4constituting the second sensing electrodes IE2-1 to IE2-8 of the inputsensor ISL4 illustrated in FIG. 10, each of the first sensing electrodesIE1-1 to IE1-10 may have the same configuration as that of each of thethird sub-sensing parts SSP3 and the fourth sub-sensing parts SSP4described in association with, for instance, FIG. 9B.

One end of the k-th fourth sensing line SL4-k of the fourth sensinglines SL4-1 to SL4-8 of the input sensor ISL4 described in associationwith FIG. 10 is connected to the other end of the k-th second sensingelectrode IE2-k of the second sensing electrodes IE2-1 to IE2-8. Thek-th fourth sensing line SL4-k is disposed between the first sub-sensorpart SSP1 and the second sub-sensor part SSP2 of each of the firstsensing electrodes IE1-1 to IE1-10 disposed between the k-th secondsensing electrode IE2-k and the (k+1)-th second sensing electrodeIE2-(k+1). The first sub-sensor parts SSP1 and the second sub-sensorpart SSP2 constituting the first sensing electrodes IE1-1 to IE1-10 ofthe input sensor ISL4 described in association with FIG. 10, each of thefirst sensing electrodes IE1-1 to IE1-10 may have the same configurationas that of each of the first sub-sensing parts SSP1 and the secondsub-sensing parts SSP2 described in association with, for instance, FIG.9B.

FIG. 11 is a plan view of an input sensor ISL5 according to someexemplary embodiments.

Since the input sensor ISL5 described in association with FIG. 11 has aconfiguration similar to that of the input sensors ISL3 and ISL4described in association with FIGS. 9A and 10, duplicated descriptionswill be omitted.

One end of a k-th third sensing line SL3-k of the third sensing linesSL3-1 to SL3-10 of the input sensor ISL5 described in association withFIG. 11 is connected to the other end of a k-th first sensing electrodeIE1-k of the first sensing electrodes IE1-1 to IE1-10. The k-th thirdsensing line SL3-k is disposed between the third sub-sensing parts SSP3and the fourth sub-sensing parts SSP4 of each of the second sensingelectrodes IE2-1 to IE2-8 disposed between a (k+1)-th first sensingelectrode IE1-(k+1) and a (k+3)-th first sensing electrode IE1-(k+3).The third sub-sensor parts SSP3 and the fourth sub-sensor part SSP4constituting the second sensing electrodes IE2-1 to IE2-8 of the inputsensor ISL5 described in association with FIG. 11 may have the sameconfiguration as that of each of the third sub-sensing part SSP3 and thefourth sub-sensing part SSP4 described in association with, forinstance, FIG. 9B.

One end of the k-th fourth sensing line SL4-k of the fourth sensinglines SL4-1 to SL4-8 of the input sensor ISL4 described in associationwith FIG. 11 is connected to the other end of the k-th second sensingelectrode IE2-k of the second sensing electrodes IE2-1 to IE2-8. Thek-th fourth sensing line SL4-k is disposed between the first sub-sensingparts SSP1 and the second sub-sensing parts SSP2 of each of the firstsensing electrodes IE1-1 to IE1-10 disposed between a (k+1)-th secondsensing electrode IE2-(k+1) and a (k+2)-th second sensing electrodeIE2-(k+2). The first sub-sensor parts SSP1 and the second sub-sensorparts SSP2 constituting the first sensing electrodes IE1-1 to IE1-10 ofthe input sensor ISL5 illustrated in FIG. 11 may have the sameconfiguration as that of each of the first sub-sensing parts SSP1 andthe second sub-sensing parts SSP2 described in association with, forinstance, FIG. 9B.

The arranged positions of the third sensing lines SL3-1 to SL3-10 andthe fourth sensing lines SL4-1 to SL4-8 are not limited to the examplesillustrated in FIGS. 9A, 10, and 11, and thus, may be variously changed.

FIG. 12A is a plan view of an input sensor ISL6 according to someexemplary embodiments. FIG. 12B is an enlarged view illustrating afourth area DD of the input sensor ISL6 of FIG. 12A according to someexemplary embodiments. FIG. 12C is a partial cross-sectional view takenalong sectional line X-X′ of FIG. 12B according to some exemplaryembodiments.

The input sensor ISL6 described in association with FIGS. 12A to 12C mayinclude first sensing electrodes IE1-1 to IE1-10, second sensingelectrodes IE2-1 to IE2-8, first connection Lines CNL1-1 to CNL1-5,second connection lines CNL2-1 to CNL2-4, first sensing lines SL1-1 toSL1-10, and second sensing lines SL2-1 to SL2-8 that are the same asthose of the input sensor ISL described in association with at leastFIG. 7A.

Each of the first sensing electrodes IE1-1 to IE1-10 includes aplurality of first sensing parts SP1 and a plurality of first connectionpatterns BP1. Each of the second sensing electrodes IE2-1 to IE2-8includes a plurality of second sensing parts SP2 and a plurality ofsecond connection patterns BP2.

As illustrated in FIG. 12B, each of the first sensing electrodes IE1-1to IE1-10, the second sensing electrodes IE2-1 to IE2-8, and the secondconnection patterns BP2 of the input sensor ISL6 may include a pluralityof mesh lines MSL. The mesh lines MSL include first mesh lines MSL1extending in a fourth direction DR4 and second mesh lines MSL2 extendingin a fifth direction DR5 to cross the first mesh lines MSL1.Predetermined openings MSL-OP may be defined by the first mesh linesMSL1 and the second mesh lines MSL2.

According some embodiments, the first sensing parts SP1 are disposed onthe same layer as the second sensing parts SP2 and the first connectionpatterns BP1, and the first sensing parts SP1, the second sensing partsSP2, and the first connection patterns BP1 are disposed on a layer thatis different from that of the second connection patterns BP2.

As illustrated in FIG. 12C, the first sensing parts SP1 of the firstsensing electrodes IE1-1 to IE1-10 and the second sensing parts SP2 ofthe second sensing electrodes IE2-1 to IE2-8 are disposed on the secondinput insulation layer ISL-IL2. The second connection patterns BP2 aredisposed on the first input insulation layer ISL-IL1. The secondconnection patterns BP2 may be connected to the first sensing parts SP1through connection contact holes CH_S defined to pass through the secondinput insulation layer ISL-IL2.

In some embodiments, the input sensor ISL described in association withat least FIG. 7A, the input sensor ISL2 described in association with atleast FIG. 8A, the input sensor ISL3 described in association with atleast FIG. 9A, the input sensor ISL4 described in association with FIG.10, and the input sensor ISL5 described in association with FIG. 11, thefirst sensing electrodes IE1-1 to IE1-10, the second sensing electrodesIE2-1 to IE2-8, the first connection parts CP1, and the secondconnection parts CP2 may include a plurality of mesh lines MSL similarto the input sensor ISL6.

According to various exemplary embodiments, an input sensor may sense atouch interaction by a user's body and a touch interaction by anelectronic pen. For instance, pen sensing electrodes that sense thetouch interaction by the electronic pen using conductive patternsforming the sensing electrodes that sense the user's touch interactionmay be provided to minimize the thickness of the display device andreduce the production cost.

Although certain exemplary embodiments and implementations have beendescribed herein, other embodiments and modifications will be apparentfrom this description. Accordingly, the inventive concepts are notlimited to such embodiments, but rather to the broader scope of theaccompanying claims and various obvious modifications and equivalentarrangements as would be apparent to one of ordinary skill in the art.

What is claimed is:
 1. An input sensor comprising: a plurality of firstsensing electrodes; a plurality of second sensing electrodes; aplurality of first sensing lines electrically connected to the pluralityof first sensing electrodes, respectively; a plurality of second sensinglines electrically connected to the plurality of second sensingelectrodes, respectively; a first connection line electricallyconnecting a pair of first sensing electrodes of the plurality of firstsensing electrodes; and a second connection line electrically connectinga pair of second sensing electrodes of the plurality of second sensingelectrodes.
 2. The input sensor of claim 1, wherein the plurality offirst sensing electrodes and the plurality of second sensing electrodesare insulated from each other.
 3. The input sensor of claim 1, wherein:the plurality of first sensing electrodes and the plurality of secondsensing electrodes are configured to sense a first input during a firstsensing mode; and the pair of first sensing electrodes and the pair ofsecond sensing electrodes are configured to sense a second input duringa second sensing mode.
 4. The input sensor of claim 1, wherein: each ofthe plurality of first sensing electrodes comprises a plurality of firstsensing parts and a first connection part electrically connecting theplurality of first sensing parts to each other; and each of theplurality of second sensing electrodes comprises a plurality of secondsensing parts and a second connection part electrically connecting theplurality of second sensing parts to each other.
 5. The input sensor ofclaim 4, further comprising: a first conductive layer; a secondconductive layer; and an insulation layer disposed between the firstconductive layer and the second conductive layer, wherein: the firstconnection part is formed from the first conductive layer; the pluralityof first sensing parts, the plurality of second sensing parts, and thesecond connection part are formed from the second conductive layer; andthe plurality of first sensing parts are connected to the firstconnection part through contact holes passing through the insulationlayer.
 6. The input sensor of claim 5, wherein the plurality of firstsensing lines, the plurality of second sensing lines, the firstconnection line, and the second connection line are formed from thesecond conductive layer.
 7. An input sensor comprising: a plurality offirst sensing electrodes, each of which comprises a plurality of firstsub-sensor parts, a plurality of second sub-sensor parts, and aplurality of first sub-connection parts; a plurality of second sensingelectrodes insulated from the plurality of first sensing electrodes,each of the plurality of second sensing electrodes comprising aplurality of third sub-sensor parts, a plurality of fourth sub-sensorparts, and a plurality of second sub-connection parts; a plurality offirst sensing lines electrically connected to first ends of theplurality of first sensing electrodes, respectively; a plurality ofsecond sensing lines electrically connected to first ends of theplurality of second sensing electrodes, respectively; a plurality ofthird sensing lines disposed between the plurality of third sub-sensorparts and the plurality of fourth sub-sensor parts, each of theplurality of third sensing lines having one end electrically connectedto a second end of a corresponding one of the plurality of first sensingelectrodes, and a plurality of fourth sensing lines disposed between theplurality of first sub-sensor parts and the plurality of secondsub-sensor parts, each of the plurality of fourth sensing lines havingone end electrically connected to a second end of a corresponding one ofthe plurality of second sensing electrodes, wherein: the plurality offirst sub-connection parts electrically connect the plurality of firstsub-sensor parts to the plurality of second sub-sensor parts; and theplurality of second sub-connection parts electrically connect theplurality of third sub-sensor parts to the plurality of fourthsub-sensor parts.
 8. The input sensor of claim 7, wherein: one firstsensing line of the plurality of first sensing lines, one first sensingelectrode of the plurality of first sensing electrodes, and one thirdsensing line of the plurality of third sensing lines provide one signalpath; and one second sensing line of the plurality of second sensinglines, one second sensing electrode of the plurality of second sensingelectrodes, and one fourth sensing line of the plurality of fourthsensing lines provide one signal path.
 9. The input sensor of claim 7,wherein: the plurality of first sensing electrodes and the plurality ofsecond sensing electrodes are configured to sense a first input in afirst sensing mode; one first sensing line of the plurality of firstsensing lines, one first sensing electrode of the plurality of firstsensing electrodes, and one third sensing line of the plurality of thirdsensing lines is configured to sense a second input in a second sensingmode; and one second sensing line of the plurality of second sensinglines, one second sensing electrode of the plurality of second sensingelectrodes, and one fourth sensing line of the plurality of fourthsensing lines is configured to sense the second input in the secondsensing mode.
 10. The input sensor of claim 7, wherein: the plurality offirst sensing electrodes are arranged in a first direction; theplurality of second sensing electrodes are arranged in a seconddirection crossing the first direction; the plurality of firstsub-sensor parts and the plurality of second sub-sensor parts are spacedapart from each other in the second direction; and the plurality ofthird sub-sensor parts and the plurality of fourth sub-sensor parts arespaced part from each other in the first direction.
 11. The input sensorof claim 10, wherein: each of the plurality of first sensing electrodescomprises a plurality of first sensing parts and a first connection partconnecting the plurality of first sensing parts to each other; and eachof the plurality of first sensing parts comprises one of the pluralityof first sub-sensor parts and one of the plurality of second sub-sensorparts.
 12. The input sensor of claim 11, wherein: each of the pluralityof second sensing electrodes comprises a plurality of second sensingparts and a second connection part connecting the plurality of secondsensing parts to each other; and each of the plurality of second sensingparts comprises one of the plurality of third sub-sensor parts and oneof the plurality of fourth sub-sensor parts.
 13. The input sensor ofclaim 12, further comprising: a first conductive layer; a secondconductive layer; and an insulation layer disposed between the firstconductive layer and the second conductive layer, wherein: each of thefirst connection part, the plurality of first sub-connection parts, andthe plurality of second sub-connection parts is formed from the firstconductive layer; and each of the plurality of first sub-sensor parts,the plurality of the second sub-sensor parts, the plurality of thirdsub-sensor parts, the plurality of fourth sub-sensor parts, and thesecond connection part is formed from the second conductive layer. 14.The input sensor of claim 13, wherein: one of the plurality of firstsub-sensor parts is connected to the first sub-connection part through afirst sub-through-hole passing through the insulation layer; one of theplurality of second sub-sensor parts is connected to the firstsub-connection part through a second sub-through-hole passing throughthe insulation layer; one of the plurality of third sub-sensor parts isconnected to the second sub-connection part through a thirdsub-through-hole passing through the insulation layer; and one of theplurality of fourth sub-sensor parts is connected to the secondsub-connection part through a fourth sub-through-hole passing throughthe insulation layer.
 15. An input sensor comprising: a plurality offirst sensing electrodes, each of which comprises a plurality of firstsub-sensor parts, a plurality of second sub-sensor parts, and aplurality of first sub-connection parts; a plurality of second sensingelectrodes insulated from the plurality of first sensing electrodes,each of the plurality of second sensing electrodes comprising aplurality of third sub-sensor parts, a plurality of fourth sub-sensorparts, and a plurality of second sub-connection parts; a plurality offirst sensing lines electrically connected to first ends of theplurality of first sensing electrodes, respectively; a plurality ofsecond sensing lines electrically connected to first ends of theplurality of second sensing electrodes, respectively; a plurality ofthird sensing lines disposed between the plurality of first sub-sensorparts and the plurality of second sub-sensor parts; and a plurality offourth sensing lines disposed between the plurality of third sub-sensorparts and the plurality of fourth sub-sensor parts; wherein: a pair ofcorresponding third sensing lines of the plurality of third sensinglines are electrically connected to each other; a pair of correspondingfourth sensing lines of the plurality of fourth sensing lines areelectrically connected to each other; the plurality of firstsub-connection parts and the plurality of second sub-connection partsare formed from a first conductive layer; the plurality of first tofourth sub-sensor parts and the plurality of first to fourth sensinglines are formed from a second conductive layer; and an insulation layeris disposed between the first conductive layer and the second conductivelayer.
 16. The input sensor of claim 15, wherein: the plurality of firstsensing electrodes are arranged in a first direction; the plurality ofsecond sensing electrodes are arranged in a second direction crossingthe first direction; the plurality of first sub-sensor parts and theplurality of second sub-sensor parts are spaced apart from each other inthe second direction; and the plurality of third sub-sensor parts andthe plurality of fourth sub-sensor parts are spaced part from each otherin the first direction.
 17. The input sensor of claim 15, wherein: eachof the plurality of first sensing electrodes comprises a plurality offirst sensing parts and a first connection part connecting the pluralityof first sensing parts to each other; each of the plurality of firstsensing parts comprises one of the plurality of first sub-sensor partsand one of the plurality of second sub-sensor parts; each of theplurality of second sensing electrodes comprises a plurality of secondsensing parts and a second connection part connecting the plurality ofsecond sensing parts to each other; and each of the plurality of secondsensor parts comprises one of the plurality of third sub-sensor partsand one of the plurality of fourth sub-sensor parts.
 18. A displaydevice comprising: a display panel configured to display an image; aninput sensor disposed on a first surface of the display panel; and asensing circuit configured to receive first input information and secondinput information from the input sensor, wherein the input sensorcomprises: a plurality of first sensing electrodes; a plurality of firstsensing lines electrically connected to the plurality of first sensingelectrodes, respectively; a plurality of second sensing electrodes; aplurality of second sensing lines electrically connected to theplurality of second sensing electrodes, respectively; a first connectionline electrically connecting a pair of first sensing electrodes of theplurality of first sensing electrodes; and a second connection lineelectrically connecting a pair of second sensing electrodes of theplurality of second sensing electrodes, and wherein the sensing circuitis further configured to: receive the first input information throughthe plurality of first sensing lines and the plurality of second sensinglines in a first sensing mode; and receive the second input informationthrough the plurality of first sensing lines and the plurality of secondsensing lines in a second sensing mode.
 19. The display device of claim18, wherein: the plurality of first sensing electrodes and the pluralityof second sensing electrodes are configured to sense a first input inthe first sensing mode; and the plurality of first sensing electrodesand the plurality of second sensing electrodes are configured to sense asecond input in the second sensing mode.
 20. The display device of claim18, wherein: each of the plurality of first sensing electrodes comprisesa plurality of first sensing parts and a first connection partelectrically connecting the plurality of first sensing parts to eachother; and each of the plurality of second sensing electrodes comprisesa plurality of second sensing parts and a second connection partelectrically connecting the plurality of second sensing parts to eachother.